NVIDIA GA10B 16SM 765MHz vs Intel UHD 64EU 1200MHz Gen 12 Full Specs

Summary

1,024 Shaders 765MHz	512 Shaders 1.2GHz
Shared Memory102.4GB/sLPDDR5	Shared Memory102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4
Peak·FP32·FP16 1.57 TFLOPS	Peak·FP32·FP16 1.23 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed765MHz UC·Boost·OC	Clock Speed1200MHz UC·Base·Boost·OC
Peak OPS 100.3 TOPSINT4 Tensor Sparse	Peak OPS 2.46 TFLOPSFP16
Tensor FP16-16 12.53 TFLOPS FP16-16 Tensor Sparse 25.07 TFLOPS Tensor FP16-32 12.53 TFLOPS FP16-32 Tensor Sparse 25.07 TFLOPS	-
Tensor BF16 12.53 TFLOPS BF16 Tensor Sparse 25.07 TFLOPS	-
Tensor TF32 6.27 TFLOPS	Tensor TF32 -
FP32 1.57 TFLOPS	FP32 1.23 TFLOPS
-	FP64 307.2 GFLOPS
Tensor INT4 50.14 TOPS	Tensor INT4 -
Tensor INT8 25.07 TOPS	-
Pixel Rate 12.2 GPixel/s	Pixel Rate 19.2 GPixel/s
Texture Rate 6.1 GTexel/s	Texture Rate 38.4 GTexel/s

Core Config

Shaders 1,024 Shaders	Shaders 512 Shaders
TMUs 8 TMUs	TMUs 32 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores 32 T-Cores	Tensor Cores -
SMs 8 SMs	EUs 64 EUs

Clocks

Base Clock -	Base Clock 300MHz
Boost Clock 765MHz	Boost Clock 1.2GHz

Cache

L2 Cache 2MB shared	L2 Cache 512KB shared
L3 Cache -	L3 Cache 2MB shared

Memory

Shared MemoryLPDDR5	Shared Memory LPDDR5X·DDR5·LPDDR4X·DDR4
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 6.4GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 102.4GB/s	Memory Bandwidth 102.4GB/s
ECC No	ECC No

Video Output

Multi-Monitor -

Multi-Monitor 4

Encoder

Encoder Model NVENC 7	Encoder Model Quick Sync Video 8
Codec - - AVC (H.264) HEVC (H.265) -	Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Model NVDEC 5	Decoder Model Quick Sync Video 8
Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Ampere	Architecture Gen 12
Family Jetson	Family Gen 12
Branding	Branding
Codename Hercules	Codename Xe LP
Chip Variant -	Chip Variant GT1
Market Segment Embedded	Market Segment Laptop
Release Date Jan 1, 2023	Release Date Jan 1, 2023

Fabrication

Foundry Samsung	Foundry Intel
Fabrication Node 8N	Fabrication Node Intel 7
Die Size -	Die Size 161mm²
Transistor Count 17 Billion	Transistor Count 11.9 Billion
Transistor Density -	Transistor Density 74 MTr/mm²

Images