NVIDIA GA10B 28SM vs Intel UHD 48EU 1300MHz Gen 12 Full Specs

Summary

1,792 Shaders 930MHz	384 Shaders 1.3GHz
Shared Memory204.8GB/sLPDDR5	Shared Memory102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4
Peak·FP32·FP16 3.33 TFLOPS	Peak·FP32·FP16 998.4 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 FP16-16 Tensor Sparse Tensor FP16-32 FP16-32 Tensor Sparse FP64 Tensor BF16 BF16 Tensor Sparse Tensor TF32 Tensor INT8 Tensor INT4 Memory Bandwidth

GA10B 28SM213.3 TOPSINT4 Tensor Sparse

x106.83

UHD 48EU 1300MHz Gen 122 TFLOPSFP16

x1

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Theoretical Performance

Clock Speed930MHz UC·Boost·OC	Clock Speed1300MHz UC·Base·Boost·OC
Peak OPS 213.3 TOPSINT4 Tensor Sparse	Peak OPS 2 TFLOPSFP16
Tensor FP16-16 26.66 TFLOPS FP16-16 Tensor Sparse 53.33 TFLOPS Tensor FP16-32 26.66 TFLOPS FP16-32 Tensor Sparse 53.33 TFLOPS	-
Tensor BF16 26.66 TFLOPS BF16 Tensor Sparse 53.33 TFLOPS	-
Tensor TF32 13.33 TFLOPS	Tensor TF32 -
FP32 3.33 TFLOPS	FP32 998.4 GFLOPS
-	FP64 249.6 GFLOPS
Tensor INT4 106.7 TOPS	Tensor INT4 -
Tensor INT8 53.33 TOPS	-
Pixel Rate 22.3 GPixel/s	Pixel Rate 15.6 GPixel/s
Texture Rate 13 GTexel/s	Texture Rate 31.2 GTexel/s

Core Config

Shaders 1,792 Shaders	Shaders 384 Shaders
TMUs 14 TMUs	TMUs 24 TMUs
ROPs 24 ROPs	ROPs 12 ROPs
Tensor Cores 56 T-Cores	Tensor Cores -
SMs 14 SMs	EUs 48 EUs

Clocks

Base Clock -	Base Clock 300MHz
Boost Clock 930MHz	Boost Clock 1.3GHz

Cache

L2 Cache 4.1MB shared	L2 Cache 448KB shared
L3 Cache -	L3 Cache 1MB shared

Memory

Shared MemoryLPDDR5	Shared Memory LPDDR5X·DDR5·LPDDR4X·DDR4
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 6.4GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 204.8GB/s	Memory Bandwidth 102.4GB/s
ECC No	ECC No

Video Output

Multi-Monitor -

Multi-Monitor 4

Encoder

Encoder Model NVENC 7

Encoder Model Quick Sync Video 8

Decoder

Decoder Model NVDEC 5

Decoder Model Quick Sync Video 8

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Ampere	Architecture Gen 12
Family Jetson	Family Gen 12
Branding	Branding
Codename Hercules	Codename Xe LP
Chip Variant -	Chip Variant GT1
Market Segment Embedded	Market Segment Laptop
Release Date Oct 1, 2022	Release Date Jan 1, 2023

Fabrication

Foundry Samsung	Foundry Intel
Fabrication Node 8N	Fabrication Node Intel 7
Die Size -	Die Size 208mm²
Transistor Count 17 Billion	Transistor Count 15.2 Billion
Transistor Density -	Transistor Density 73 MTr/mm²

Images

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Used In

CPUs AGX Orin 32GB

CPUs Core i3-13300HE Core i3-13300HRE

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