NVIDIA GeForce 830M vs Intel Graphics 2C 2300MHz Full Specs

Summary

256 Shaders 1.03GHz	256 Shaders 2.3GHz
2GB DDR314.4GB/s placeholder	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 526.9 GFLOPS	Peak·FP32·FP16 1.18 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 25W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

GeForce 830M526.8 GFLOPSFP32

x1

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x71.53

Show Top Score

Theoretical Performance

Clock Speed1029MHz UC·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 526.9 GFLOPSFP32	Peak OPS 37.68 TOPSINT4 Tensor
-	Tensor FP16-32 9.42 TFLOPS
-	Tensor BF16 9.42 TFLOPS
FP32 526.9 GFLOPS	FP32 1.18 TFLOPS
FP64 16.46 GFLOPS	FP64 294.4 GFLOPS
Tensor INT4 -	Tensor INT4 37.68 TOPS
-	Tensor INT8 18.84 TOPS
Pixel Rate 8.2 GPixel/s	Pixel Rate 18.4 GPixel/s
Texture Rate 16.5 GTexel/s	Texture Rate 36.8 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 256 Shaders
TMUs 16 TMUs	TMUs 16 TMUs
ROPs 8 ROPs	ROPs 8 ROPs
Tensor Cores -	Tensor Cores 16 T-Cores
RT Cores -	RT Cores 2 RT-Cores
SMs 2 SMs	EUs 16 EUs

Clocks

Boost Clock 1.03GHz

Boost Clock 2.3GHz

Cache

L2 Cache 1MB shared

L2 Cache 4.1MB shared

Memory

2GB DDR3 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 1.8GT/s	Memory Speed 7.5GT/s
Memory Bandwidth 14.4GB/s	Memory Bandwidth 119.5GB/s
ECC No	ECC No

Power & Thermals

TDP 25W

TDP Shared

Video Output

Multi-Monitor 2

Multi-Monitor 3

Encoder

-	Encoder Model Xe Media Engine

Decoder

Decoder Model VP6

Decoder Model Xe Media Engine

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Maxwell	Architecture Battlemage
Family GeForce 800	Family Gen 13
Branding	Branding
Codename NV118	Codename Xe3 LPG
Chip Variant -	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Mar 12, 2014	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node 28nm	Fabrication Node Intel 3
Die Size 89mm²	Die Size 27mm²
Transistor Count 1.1 Billion	Transistor Count -
Transistor Density 12.61 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs -

CPUs Core Ultra 5 322 Core Ultra 5 332

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