NVIDIA GeForce 845M 4SM vs Intel Graphics 4C 2300MHz Full Specs

Summary

512 Shaders 863MHz	512 Shaders 2.3GHz
2GB DDR316GB/s placeholder	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 883.7 GFLOPS	Peak·FP32·FP16 2.35 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 45W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

GeForce 845M 4SM883.7 GFLOPSFP32

x1

Graphics 4C 2300MHz75.37 TOPSINT4 Tensor

x85.28

Show Top Score

Theoretical Performance

Clock Speed863MHz UC·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 883.7 GFLOPSFP32	Peak OPS 75.37 TOPSINT4 Tensor
-	Tensor FP16-32 18.84 TFLOPS
-	Tensor BF16 18.84 TFLOPS
FP32 883.7 GFLOPS	FP32 2.35 TFLOPS
FP64 27.62 GFLOPS	FP64 588.8 GFLOPS
Tensor INT4 -	Tensor INT4 75.37 TOPS
-	Tensor INT8 37.68 TOPS
Pixel Rate 13.8 GPixel/s	Pixel Rate 36.8 GPixel/s
Texture Rate 27.6 GTexel/s	Texture Rate 73.6 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 512 Shaders
TMUs 32 TMUs	TMUs 32 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores -	RT Cores 4 RT-Cores
SMs 4 SMs	EUs 32 EUs

Clocks

Boost Clock 863MHz

Boost Clock 2.3GHz

Cache

L2 Cache 2MB shared

L2 Cache 4.1MB shared

Memory

2GB DDR3 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 2GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 16GB/s	Memory Bandwidth 136.5GB/s

Power & Thermals

TDP 45W

TDP Shared

Video Output

Multi-Monitor 2

Multi-Monitor 3

Encoder

Encoder Model NVENC 2

Encoder Model Xe Media Engine

Decoder

Decoder Model NVDEC 1

Decoder Model Xe Media Engine

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Maxwell	Architecture Battlemage
Family GeForce 800	Family Gen 13
Branding	Branding
Codename NV117	Codename Xe3 LPG
Chip Variant GM107-220-A2	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Aug 16, 2015	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node 28nm	Fabrication Node Intel 3
Die Size 148mm²	Die Size 27mm²
Transistor Count 1.9 Billion	Transistor Count -
Transistor Density 12.64 MTr/mm²	Transistor Density -

Images

No images available

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Used In

CPUs -

CPUs Core Ultra 5 336H

Competitors

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