GPUs

NVIDIA GeForce FX 5700 Ultra vs MSI GeForce RTX 3050 LP 6G OC Full Specs

4 Shaders
475MHz
2,304 Shaders
1.49GHz
262MB GDDR214.4GB/s
6GB GDDR6168GB/s
··
-
··
6.88 TFLOPS
Form Factor
AGP 8x Card
Form Factor
PCIe Card
TDP
46W
TDP
70W
Power Connectors
1x Molex
Power Connectors
-

GeForce FX 5700 UltraGeForce FX 5700 Ultra-
-
GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x1

Clock Speed
··
Clock Speed
···
Peak OPS
-
Peak OPS
220 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
Tensor TF32
-
Tensor TF32
6.88 TFLOPS
-
FP32
6.88 TFLOPS
-
FP64
107.4 GFLOPS
Tensor INT4
-
Tensor INT4
110 TOPS
-
Tensor INT8
55 TOPS
Ray
-
Ray
10.37 TOPS
Pixel Rate
1.9 GPixel/s
Pixel Rate
47.7 GPixel/s
Texture Rate
1.9 GTexel/s
Texture Rate
107.4 GTexel/s

Shaders
4 Shaders
Shaders
2,304 Shaders
TMUs
4 TMUs
TMUs
72 TMUs
ROPs
4 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
Units
-
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
475MHz
Boost Clock
1.49GHz

L2 Cache
-
L2 Cache
2MB shared

262MB GDDR2
6GB GDDR6
Memory Bus
128-bit
Memory Bus
96-bit
Memory Speed
900MT/s
Memory Speed
14GT/s
Memory Bandwidth
14.4GB/s
Memory Bandwidth
168GB/s

TDP
46W
TDP
70W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
1x DisplayPort 1.4
-
2x HDMI 2.1
1x DVI-I Single-Link
-
1x VGA
-
1x S-Video
-

-
Encoder Model
NVENC 7

Decoder Model
VPE 3.0
Decoder Model
NVDEC 5

Form Factor
AGP 8x Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
229 mm (9.02")
Depth
20 mm (0.79")
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans
Power Connectors
1x Molex
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce FX branding
Branding
GeForce RTX 2018 branding
Codename
NV36
Codename
NV177
Chip Variant
-
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Oct 23, 2003
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
130nm
Fabrication Node
8N
Die Size
133mm²
Die Size
200mm²
Transistor Count
82 Million
Transistor Count
8.7 Billion
Transistor Density
0.62 MTr/mm²
Transistor Density
43.5 MTr/mm²

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