GPUs

NVIDIA GeForce FX 5800 vs MSI GeForce RTX 3050 LP 6G OC Full Specs

4 Shaders
400MHz
2,304 Shaders
1.49GHz
131MB GDDR212.8GB/s
6GB GDDR6168GB/s
··
-
··
6.88 TFLOPS
Form Factor
AGP 8x Card
Form Factor
PCIe Card
TDP
44W
TDP
70W
Power Connectors
1x Molex
Power Connectors
-

GeForce FX 5800GeForce FX 5800-
-
GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x1

Clock Speed
··
Clock Speed
···
Peak OPS
-
Peak OPS
220 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
Tensor TF32
-
Tensor TF32
6.88 TFLOPS
-
FP32
6.88 TFLOPS
-
FP64
107.4 GFLOPS
Tensor INT4
-
Tensor INT4
110 TOPS
-
Tensor INT8
55 TOPS
Ray
-
Ray
10.37 TOPS
Pixel Rate
1.6 GPixel/s
Pixel Rate
47.7 GPixel/s
Texture Rate
3.2 GTexel/s
Texture Rate
107.4 GTexel/s

Shaders
4 Shaders
Shaders
2,304 Shaders
TMUs
8 TMUs
TMUs
72 TMUs
ROPs
4 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
Units
-
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
400MHz
Boost Clock
1.49GHz

L2 Cache
-
L2 Cache
2MB shared

131MB GDDR2
6GB GDDR6
Memory Bus
128-bit
Memory Bus
96-bit
Memory Speed
800MT/s
Memory Speed
14GT/s
Memory Bandwidth
12.8GB/s
Memory Bandwidth
168GB/s
ECC
No
ECC
No

TDP
44W
TDP
70W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
1x DisplayPort 1.4
-
2x HDMI 2.1
1x DVI-I Single-Link
-
1x VGA
-
1x S-Video
-

-
Encoder Model
NVENC 7

Decoder Model
VPE 2.0
Decoder Model
NVDEC 5

Form Factor
AGP 8x Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
213 mm (8.39")
Depth
37 mm (1.46")
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans
Power Connectors
1x Molex
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce FX branding
Branding
GeForce RTX 2018 branding
Codename
NV30
Codename
NV177
Chip Variant
-
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Jan 27, 2003
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
130nm
Fabrication Node
8N
Die Size
199mm²
Die Size
200mm²
Transistor Count
125 Million
Transistor Count
8.7 Billion
Transistor Density
0.63 MTr/mm²
Transistor Density
43.5 MTr/mm²

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