GPUs

NVIDIA GeForce GT 330 DDR2 vs MSI GeForce RTX 3050 LP 6G OC Full Specs

96 Shaders
500MHz
2,304 Shaders
1.49GHz
1GB DDR216GB/s
6GB GDDR6168GB/s
··
240 GFLOPS
··
6.88 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
75W
TDP
70W

GeForce GT 330 DDR2GeForce GT 330 DDR2240 GFLOPSFP32
x1
GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x916.68

Clock Speed
··
Clock Speed
···
Peak OPS
240 GFLOPSFP32
Peak OPS
220 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
Tensor TF32
-
Tensor TF32
6.88 TFLOPS
FP32
240 GFLOPS
FP32
6.88 TFLOPS
-
FP64
107.4 GFLOPS
Tensor INT4
-
Tensor INT4
110 TOPS
-
Tensor INT8
55 TOPS
Ray
-
Ray
10.37 TOPS
Pixel Rate
20 GPixel/s
Pixel Rate
47.7 GPixel/s
Texture Rate
40 GTexel/s
Texture Rate
107.4 GTexel/s

Shaders
96 Shaders
Shaders
2,304 Shaders
TMUs
32 TMUs
TMUs
72 TMUs
ROPs
16 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
SMs
12 SMs
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
500MHz
Boost Clock
1.49GHz
Shader Clock
1.25GHz
Shader Clock
-

L2 Cache
64KB shared
L2 Cache
2MB shared

1GB DDR2
6GB GDDR6
Memory Bus
128-bit
Memory Bus
96-bit
Memory Speed
1GT/s
Memory Speed
14GT/s
Memory Bandwidth
16GB/s
Memory Bandwidth
168GB/s
ECC
No
ECC
No

TDP
75W
TDP
70W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
1x DisplayPort 1.4
-
2x HDMI 2.1
1x HDMI 1.3
-
1x DVI-I Dual-Link
-
1x VGA
-

-
Encoder Model
NVENC 7

Decoder Model
VP2
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
168 mm (6.61")
Depth
20 mm (0.79")
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce 2006 branding
Branding
GeForce RTX 2018 branding
Codename
NV92
Codename
NV177
Chip Variant
-
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Feb 1, 2010
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
55nm
Fabrication Node
8N
Die Size
260mm²
Die Size
200mm²
Transistor Count
754 Million
Transistor Count
8.7 Billion
Transistor Density
2.9 MTr/mm²
Transistor Density
43.5 MTr/mm²

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