GPUs

NVIDIA GeForce GTX 1660 Ti Max-Q vs NVIDIA GeForce RTX 3060 Laptop 80W Full Specs

1,536 Shaders
1.33GHz
3,840 Shaders
1.43GHz
6GB GDDR6288GB/s
6GB GDDR6336GB/s
··
4.1 TFLOPS
··
10.94 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
60W
TDP
80W

Clock Speed
···
Clock Speed
···
Peak OPS
8.2 TFLOPSFP16
Peak OPS
350.2 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
43.78 TFLOPS
FP16-16 Tensor Sparse
87.55 TFLOPS
Tensor FP16-32
21.89 TFLOPS
FP16-32 Tensor Sparse
43.78 TFLOPS
-
BF16
10.94 TFLOPS
Tensor BF16
21.89 TFLOPS
BF16 Tensor Sparse
43.78 TFLOPS
Tensor TF32
-
Tensor TF32
10.94 TFLOPS
FP32
4.1 TFLOPS
FP32
10.94 TFLOPS
FP64
128.2 GFLOPS
FP64
171 GFLOPS
Tensor INT4
-
Tensor INT4
175.1 TOPS
-
Tensor INT8
87.55 TOPS
Ray
-
Ray
16.51 TOPS
Pixel Rate
64.1 GPixel/s
Pixel Rate
68.4 GPixel/s
Texture Rate
128.2 GTexel/s
Texture Rate
171 GTexel/s

Shaders
1,536 Shaders
Shaders
3,840 Shaders
TMUs
96 TMUs
TMUs
120 TMUs
ROPs
48 ROPs
ROPs
48 ROPs
Tensor Cores
-
Tensor Cores
120 T-Cores
RT Cores
-
RT Cores
30 RT-Cores
SMs
24 SMs
SMs
30 SMs

Base Clock
1.14GHz
Base Clock
900MHz
Boost Clock
1.33GHz
Boost Clock
1.43GHz

L2 Cache
1.5MB shared
L2 Cache
3MB shared

6GB GDDR6
6GB GDDR6
Memory Bus
192-bit
Memory Bus
192-bit
Memory Speed
12GT/s
Memory Speed
14GT/s
Memory Bandwidth
288GB/s
Memory Bandwidth
336GB/s
ECC
No
ECC
No

TDP
60W
TDP
80W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
HDCP 2.3

Encoder Model
NVENC 7
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
Codec
AVC (H.264)
HEVC (H.265)

Decoder Model
NVDEC 4
Decoder Model
NVDEC 5
Codec
MPEG-1
MPEG-2
MPEG-4
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
-
Codec
MPEG-1
MPEG-2
MPEG-4
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce GTX 2019 branding
Branding
GeForce RTX 2018 branding
Codename
NV168
Codename
NV176
Chip Variant
TU116-250-KA-A1
Chip Variant
GA106-150-KA-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Apr 23, 2019
Release Date
Feb 25, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
12FFN
Fabrication Node
8N
Die Size
284mm²
Die Size
276mm²
Transistor Count
6.6 Billion
Transistor Count
13.3 Billion
Transistor Density
23.24 MTr/mm²
Transistor Density
48.01 MTr/mm²