NVIDIA GeForce GTX 965M vs Intel Graphics 4C 2300MHz Full Specs

Summary

1,024 Shaders 944MHz	512 Shaders 2.3GHz
2GB GDDR580GB/s placeholder	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 1.93 TFLOPS	Peak·FP32·FP16 2.35 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 60W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

GeForce GTX 965M1.93 TFLOPSFP32

x1

Graphics 4C 2300MHz75.37 TOPSINT4 Tensor

x38.98

Show Top Score

Theoretical Performance

Clock Speed944MHz UC·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 1.93 TFLOPSFP32	Peak OPS 75.37 TOPSINT4 Tensor
-	Tensor FP16-32 18.84 TFLOPS
-	Tensor BF16 18.84 TFLOPS
FP32 1.93 TFLOPS	FP32 2.35 TFLOPS
FP64 60.42 GFLOPS	FP64 588.8 GFLOPS
Tensor INT4 -	Tensor INT4 75.37 TOPS
-	Tensor INT8 37.68 TOPS
Pixel Rate 30.2 GPixel/s	Pixel Rate 36.8 GPixel/s
Texture Rate 60.4 GTexel/s	Texture Rate 73.6 GTexel/s

Core Config

Shaders 1,024 Shaders	Shaders 512 Shaders
TMUs 64 TMUs	TMUs 32 TMUs
ROPs 32 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores -	RT Cores 4 RT-Cores
SMs 8 SMs	EUs 32 EUs

Clocks

Boost Clock 944MHz

Boost Clock 2.3GHz

Cache

L2 Cache 1MB shared

L2 Cache 4.1MB shared

Memory

2GB GDDR5 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 5GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 80GB/s	Memory Bandwidth 136.5GB/s
ECC No	ECC No

Power & Thermals

TDP 60W

TDP Shared

Video Output

Multi-Monitor 3

Multi-Monitor 3

Encoder

Encoder Model 2x NVENC 3

Encoder Model Xe Media Engine

Decoder

Decoder Model NVDEC 1

Decoder Model Xe Media Engine

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Maxwell 2	Architecture Battlemage
Family GeForce 900	Family Gen 13
Branding	Branding
Codename NV124	Codename Xe3 LPG
Chip Variant -	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2015	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node 28nm	Fabrication Node Intel 3
Die Size 398mm²	Die Size 27mm²
Transistor Count 5.2 Billion	Transistor Count -
Transistor Density 13.07 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs -	CPUs Core Ultra 5 336H
Laptops Surface Book 13(Late 2016)	Laptops -
All-in-Ones Surface Studio(Late 2016)	All-in-Ones -

Competitors

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