NVIDIA GeForce MX330 vs NVIDIA GeForce MX570 Full Specs

Summary

384 Shaders 1.59GHz	2,048 Shaders 1.16GHz
2GB GDDR556GB/s	2GB GDDR696GB/s
Peak·FP32·FP16 1.22 TFLOPS	Peak·FP32·FP16 4.73 TFLOPS
Form Factor Soldered	Form Factor Soldered
TDP 25W	TDP 25W

Theoretical Performance

Clock Speed1594MHz UC·Base·Boost·OC	Clock Speed1155MHz UC·Base·Boost·OC
Peak OPS 1.22 TFLOPSFP32	Peak OPS 151.4 TOPSINT4 Tensor Sparse
-	Tensor FP16-16 18.92 TFLOPS FP16-16 Tensor Sparse 37.85 TFLOPS Tensor FP16-32 9.46 TFLOPS FP16-32 Tensor Sparse 18.92 TFLOPS
-	BF16 4.73 TFLOPS Tensor BF16 9.46 TFLOPS BF16 Tensor Sparse 18.92 TFLOPS
Tensor TF32 -	Tensor TF32 4.73 TFLOPS
FP32 1.22 TFLOPS	FP32 4.73 TFLOPS
FP64 38.26 GFLOPS	FP64 73.92 GFLOPS
Tensor INT4 -	Tensor INT4 75.69 TOPS
-	Tensor INT8 37.85 TOPS
Ray -	Ray 7.13 TOPS
Pixel Rate 25.5 GPixel/s	Pixel Rate 18.5 GPixel/s
Texture Rate 38.3 GTexel/s	Texture Rate 46.2 GTexel/s

Core Config

Shaders 384 Shaders	Shaders 2,048 Shaders
TMUs 24 TMUs	TMUs 40 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 64 T-Cores
RT Cores -	RT Cores 16 RT-Cores
SMs 3 SMs	SMs 16 SMs

Clocks

Base Clock 1.53GHz	Base Clock 1.09GHz
Boost Clock 1.59GHz	Boost Clock 1.16GHz

Cache

L2 Cache 512KB shared

L2 Cache 2MB shared

Memory

2GB GDDR5	2GB GDDR6
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 7GT/s	Memory Speed 12GT/s
Memory Bandwidth 56GB/s	Memory Bandwidth 96GB/s
ECC No	ECC No

Power & Thermals

TDP 25W

TDP 25W

Video Output

Multi-Monitor 2	Multi-Monitor 4
HDCP HDCP 2.2	HDCP HDCP 2.3

Encoder

-	Encoder Model NVENC 7
Codec -	Codec AVC (H.264) HEVC (H.265)

Decoder

Decoder Model NVDEC 3	Decoder Model NVDEC 5
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 - VP9 AVC (H.264) HEVC (H.265) -	Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor Soldered

Form Factor Soldered

Chip

Manufacturer NVIDIA	Manufacturer NVIDIA
Chip Designer NVIDIA	Chip Designer NVIDIA
Architecture Pascal	Architecture Ampere
Family GeForce MX	Family GeForce MX
Branding	Branding
Codename NV138	Codename NV177
Chip Variant GP108-200-A1	Chip Variant GA107-140-A1
Market Segment Laptop	Market Segment Laptop
Release Date Feb 12, 2020	Release Date Mar 1, 2022

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 14LPP	Fabrication Node 8N
Die Size 74mm²	Die Size 200mm²
Transistor Count 1.8 Billion	Transistor Count 8.7 Billion
Transistor Density 24.32 MTr/mm²	Transistor Density 43.5 MTr/mm²

Images