NVIDIA GeForce MX350 vs Intel Graphics 4C 2300MHz Full Specs

Summary

640 Shaders 1.47GHz	512 Shaders 2.3GHz
2GB GDDR556GB/s placeholder	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 1.88 TFLOPS	Peak·FP32·FP16 2.35 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 20W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

GeForce MX3501.88 TFLOPSFP32

x1

Graphics 4C 2300MHz75.37 TOPSINT4 Tensor

x40.11

Show Top Score

Theoretical Performance

Clock Speed1468MHz UC·Base·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 1.88 TFLOPSFP32	Peak OPS 75.37 TOPSINT4 Tensor
-	Tensor FP16-32 18.84 TFLOPS
-	Tensor BF16 18.84 TFLOPS
FP32 1.88 TFLOPS	FP32 2.35 TFLOPS
FP64 58.72 GFLOPS	FP64 588.8 GFLOPS
Tensor INT4 -	Tensor INT4 75.37 TOPS
-	Tensor INT8 37.68 TOPS
Pixel Rate 23.5 GPixel/s	Pixel Rate 36.8 GPixel/s
Texture Rate 47 GTexel/s	Texture Rate 73.6 GTexel/s

Core Config

Shaders 640 Shaders	Shaders 512 Shaders
TMUs 32 TMUs	TMUs 32 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores -	RT Cores 4 RT-Cores
SMs 5 SMs	EUs 32 EUs

Clocks

Base Clock 1.35GHz	Base Clock -
Boost Clock 1.47GHz	Boost Clock 2.3GHz

Cache

L2 Cache 512KB shared

L2 Cache 4.1MB shared

Memory

2GB GDDR5 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 7GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 56GB/s	Memory Bandwidth 136.5GB/s

Power & Thermals

TDP 20W

TDP Shared

Video Output

Multi-Monitor 2	Multi-Monitor 3
HDCP HDCP 2.2	HDCP -

Encoder

-	Encoder Model Xe Media Engine

Decoder

Decoder Model NVDEC 3

Decoder Model Xe Media Engine

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Pascal	Architecture Battlemage
Family GeForce MX	Family Gen 13
Branding	Branding
Codename NV137	Codename Xe3 LPG
Chip Variant GP107-300-A1	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Feb 12, 2020	Release Date Jan 5, 2026

Fabrication

Foundry Samsung	Foundry Intel
Fabrication Node 14LPP	Fabrication Node Intel 3
Die Size 132mm²	Die Size 27mm²
Transistor Count 3.3 Billion	Transistor Count -
Transistor Density 25 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs -	CPUs Core Ultra 5 336H
All-in-Ones Pavilion 27(Early 2021)	All-in-Ones -

Competitors

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