NVIDIA GeForce MX450 GDDR6 vs NVIDIA GeForce MX570 Full Specs

Summary

896 Shaders 1.57GHz	2,048 Shaders 1.16GHz
2GB GDDR680GB/s	2GB GDDR696GB/s
Peak·FP32·FP16 2.82 TFLOPS	Peak·FP32·FP16 4.73 TFLOPS
Form Factor Soldered	Form Factor Soldered
TDP 31W	TDP 25W

Theoretical Performance

Clock Speed1575MHz UC·Base·Boost·OC	Clock Speed1155MHz UC·Base·Boost·OC
Peak OPS 5.64 TFLOPSFP16	Peak OPS 151.4 TOPSINT4 Tensor Sparse
-	Tensor FP16-16 18.92 TFLOPS FP16-16 Tensor Sparse 37.85 TFLOPS Tensor FP16-32 9.46 TFLOPS FP16-32 Tensor Sparse 18.92 TFLOPS
-	BF16 4.73 TFLOPS Tensor BF16 9.46 TFLOPS BF16 Tensor Sparse 18.92 TFLOPS
Tensor TF32 -	Tensor TF32 4.73 TFLOPS
FP32 2.82 TFLOPS	FP32 4.73 TFLOPS
FP64 88.2 GFLOPS	FP64 73.92 GFLOPS
Tensor INT4 -	Tensor INT4 75.69 TOPS
-	Tensor INT8 37.85 TOPS
Ray -	Ray 7.13 TOPS
Pixel Rate 50.4 GPixel/s	Pixel Rate 18.5 GPixel/s
Texture Rate 88.2 GTexel/s	Texture Rate 46.2 GTexel/s

Core Config

Shaders 896 Shaders	Shaders 2,048 Shaders
TMUs 56 TMUs	TMUs 40 TMUs
ROPs 32 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 64 T-Cores
RT Cores -	RT Cores 16 RT-Cores
SMs 14 SMs	SMs 16 SMs

Clocks

Base Clock 1.4GHz	Base Clock 1.09GHz
Boost Clock 1.57GHz	Boost Clock 1.16GHz

Cache

L2 Cache 1MB shared

L2 Cache 2MB shared

Memory

2GB GDDR6	2GB GDDR6
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 10GT/s	Memory Speed 12GT/s
Memory Bandwidth 80GB/s	Memory Bandwidth 96GB/s
ECC No	ECC No

Power & Thermals

TDP 31W

TDP 25W

Video Output

Multi-Monitor 2	Multi-Monitor 4
HDCP HDCP 2.2	HDCP HDCP 2.3

Encoder

-	Encoder Model NVENC 7
Codec -	Codec AVC (H.264) HEVC (H.265)

Decoder

-	Decoder Model NVDEC 5
Codec -	Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor Soldered

Form Factor Soldered

Chip

Manufacturer NVIDIA	Manufacturer NVIDIA
Chip Designer NVIDIA	Chip Designer NVIDIA
Architecture Turing	Architecture Ampere
Family GeForce MX	Family GeForce MX
Branding	Branding
Codename NV167	Codename NV177
Chip Variant TU117-150-A1	Chip Variant GA107-140-A1
Market Segment Laptop	Market Segment Laptop
Release Date Aug 1, 2020	Release Date Mar 1, 2022

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node 12FFN	Fabrication Node 8N
Die Size 200mm²	Die Size 200mm²
Transistor Count 4.7 Billion	Transistor Count 8.7 Billion
Transistor Density 23.5 MTr/mm²	Transistor Density 43.5 MTr/mm²

Images