NVIDIA GeForce RTX 2070 Super Laptop vs NVIDIA GeForce RTX 3050 Laptop 50W Full Specs
2,560 Shaders 1.38GHz | 2,048 Shaders 1.42GHz |
8GB GDDR6448GB/s | 4GB GDDR6192GB/s |
·· 7.07 TFLOPS | ·· 5.8 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 115W | TDP 50W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 226.1 TOPSINT4 Tensor | Peak OPS 185.7 TOPSINT4 Tensor Sparse |
Tensor FP16-16 56.52 TFLOPSFP16-16 Tensor Sparse -Tensor FP16-32 28.26 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 23.22 TFLOPSFP16-16 Tensor Sparse 46.43 TFLOPSTensor FP16-32 11.61 TFLOPSFP16-32 Tensor Sparse 23.22 TFLOPS |
BF16 -Tensor BF16 28.26 TFLOPSBF16 Tensor Sparse - | BF16 5.8 TFLOPSTensor BF16 11.61 TFLOPSBF16 Tensor Sparse 23.22 TFLOPS |
Tensor TF32 28.26 TFLOPS | Tensor TF32 5.8 TFLOPS |
FP32 7.07 TFLOPS | FP32 5.8 TFLOPS |
FP64 220.8 GFLOPS | FP64 90.69 GFLOPS |
Tensor INT4 226.1 TOPS | Tensor INT4 92.86 TOPS |
Tensor INT8 113 TOPS | Tensor INT8 46.43 TOPS |
Ray 21.31 TOPS | Ray 8.75 TOPS |
Pixel Rate 88.3 GPixel/s | Pixel Rate 45.3 GPixel/s |
Texture Rate 220.8 GTexel/s | Texture Rate 90.7 GTexel/s |
Shaders 2,560 Shaders | Shaders 2,048 Shaders |
TMUs 160 TMUs | TMUs 64 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 320 T-Cores | Tensor Cores 64 T-Cores |
RT Cores 40 RT-Cores | RT Cores 16 RT-Cores |
SMs 40 SMs | SMs 16 SMs |
Base Clock 1.14GHz | Base Clock 1.19GHz |
Boost Clock 1.38GHz | Boost Clock 1.42GHz |
L2 Cache 4MB shared | L2 Cache 2MB shared |
8GB GDDR6 | 4GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 12GT/s |
Memory Bandwidth 448GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP 115W | TDP 50W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
Encoder Model NVENC 7 | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) | Codec AVC (H.264) HEVC (H.265) |
Decoder Model NVDEC 4 | Decoder Model NVDEC 5 |
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) - | Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV164 | Codename NV177 |
Chip Variant TU104-150-KC-A1 | Chip Variant GA107-140-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Apr 2, 2020 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node 12FFN | Fabrication Node 8N |
Die Size 545mm² | Die Size 200mm² |
Transistor Count 13.6 Billion | Transistor Count 8.7 Billion |
Transistor Density 24.95 MTr/mm² | Transistor Density 43.5 MTr/mm² |
