NVIDIA GeForce RTX 3050 Laptop 45W vs NVIDIA GeForce GTX 1650 Laptop Full Specs

Summary

2,048 Shaders 1.34GHz	1,024 Shaders 1.56GHz
4GB GDDR6192GB/s	2GB GDDR6192GB/s
Peak·FP32·FP16 5.5 TFLOPS	Peak·FP32·FP16 3.19 TFLOPS
Form Factor Soldered	Form Factor Soldered
TDP 45W	TDP 50W

Theoretical Performance

Clock Speed1343MHz UC·Base·Boost·OC	Clock Speed1560MHz UC·Base·Boost·OC
Peak OPS 176 TOPSINT4 Tensor Sparse	Peak OPS 6.39 TFLOPSFP16
Tensor FP16-16 22 TFLOPS FP16-16 Tensor Sparse 44.01 TFLOPS Tensor FP16-32 11 TFLOPS FP16-32 Tensor Sparse 22 TFLOPS	-
BF16 5.5 TFLOPS Tensor BF16 11 TFLOPS BF16 Tensor Sparse 22 TFLOPS	-
Tensor TF32 5.5 TFLOPS	Tensor TF32 -
FP32 5.5 TFLOPS	FP32 3.19 TFLOPS
FP64 85.95 GFLOPS	FP64 99.84 GFLOPS
Tensor INT4 88.01 TOPS	Tensor INT4 -
Tensor INT8 44.01 TOPS	-
Ray 8.3 TOPS	Ray -
Pixel Rate 43 GPixel/s	Pixel Rate 49.9 GPixel/s
Texture Rate 86 GTexel/s	Texture Rate 99.8 GTexel/s

Core Config

Shaders 2,048 Shaders	Shaders 1,024 Shaders
TMUs 64 TMUs	TMUs 64 TMUs
ROPs 32 ROPs	ROPs 32 ROPs
Tensor Cores 64 T-Cores	Tensor Cores -
RT Cores 16 RT-Cores	RT Cores -
SMs 16 SMs	SMs 16 SMs

Clocks

Base Clock 1.06GHz	Base Clock 1.4GHz
Boost Clock 1.34GHz	Boost Clock 1.56GHz

Cache

L2 Cache 2MB shared

L2 Cache 1MB shared

Memory

4GB GDDR6	2GB GDDR6
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 12GT/s	Memory Speed 12GT/s
Memory Bandwidth 192GB/s	Memory Bandwidth 192GB/s
ECC No	ECC No

Power & Thermals

TDP 45W

TDP 50W

Video Output

Multi-Monitor 3	Multi-Monitor 3
HDCP HDCP 2.3	HDCP HDCP 2.2

Encoder

Encoder Model NVENC 7	Encoder Model NVENC 7
Codec AVC (H.264) HEVC (H.265)	Codec AVC (H.264) HEVC (H.265)

Decoder

Decoder Model NVDEC 5	Decoder Model NVDEC 4
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) -

Card

Form Factor Soldered

Form Factor Soldered

Chip

Manufacturer NVIDIA	Manufacturer NVIDIA
Chip Designer NVIDIA	Chip Designer NVIDIA
Architecture Ampere	Architecture Turing
Family GeForce 30	Family GeForce 16
Branding	Branding
Codename NV177	Codename NV167
Chip Variant GA107-140-A1	Chip Variant TU117-150-A1
Market Segment Laptop	Market Segment Laptop
Release Date May 11, 2021	Release Date Apr 23, 2019

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 8N	Fabrication Node 12FFN
Die Size 200mm²	Die Size 200mm²
Transistor Count 8.7 Billion	Transistor Count 4.7 Billion
Transistor Density 43.5 MTr/mm²	Transistor Density 23.5 MTr/mm²

Images