NVIDIA GeForce RTX 3050 Laptop 45W vs NVIDIA GeForce RTX 3060 Laptop 115W Full Specs
2,048 Shaders 1.34GHz | 3,840 Shaders 1.7GHz |
4GB GDDR6192GB/s | 6GB GDDR6336GB/s |
·· 5.5 TFLOPS | ·· 13.07 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 45W | TDP 115W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 176 TOPSINT4 Tensor Sparse | Peak OPS 418.3 TOPSINT4 Tensor Sparse |
Tensor FP16-16 22 TFLOPSFP16-16 Tensor Sparse 44.01 TFLOPSTensor FP16-32 11 TFLOPSFP16-32 Tensor Sparse 22 TFLOPS | Tensor FP16-16 52.29 TFLOPSFP16-16 Tensor Sparse 104.6 TFLOPSTensor FP16-32 26.14 TFLOPSFP16-32 Tensor Sparse 52.29 TFLOPS |
BF16 5.5 TFLOPSTensor BF16 11 TFLOPSBF16 Tensor Sparse 22 TFLOPS | BF16 13.07 TFLOPSTensor BF16 26.14 TFLOPSBF16 Tensor Sparse 52.29 TFLOPS |
Tensor TF32 5.5 TFLOPS | Tensor TF32 13.07 TFLOPS |
FP32 5.5 TFLOPS | FP32 13.07 TFLOPS |
FP64 85.95 GFLOPS | FP64 204.2 GFLOPS |
Tensor INT4 88.01 TOPS | Tensor INT4 209.1 TOPS |
Tensor INT8 44.01 TOPS | Tensor INT8 104.6 TOPS |
Ray 8.3 TOPS | Ray 19.71 TOPS |
Pixel Rate 43 GPixel/s | Pixel Rate 81.7 GPixel/s |
Texture Rate 86 GTexel/s | Texture Rate 204.2 GTexel/s |
Shaders 2,048 Shaders | Shaders 3,840 Shaders |
TMUs 64 TMUs | TMUs 120 TMUs |
ROPs 32 ROPs | ROPs 48 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores 120 T-Cores |
RT Cores 16 RT-Cores | RT Cores 30 RT-Cores |
SMs 16 SMs | SMs 30 SMs |
Base Clock 1.06GHz | Base Clock 1.39GHz |
Boost Clock 1.34GHz | Boost Clock 1.7GHz |
L2 Cache 2MB shared | L2 Cache 3.1MB shared |
4GB GDDR6 | 6GB GDDR6 |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 12GT/s | Memory Speed 14GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 336GB/s |
ECC No | ECC No |
TDP 45W | TDP 115W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
Encoder Model NVENC 7 | Encoder Model NVENC 7 |
Decoder Model NVDEC 5 | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename NV176 |
Chip Variant GA107-140-A1 | Chip Variant GA106-150-KA-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date May 11, 2021 | Release Date Feb 25, 2021 |
Foundry Samsung | Foundry Samsung |
Fabrication Node 8N | Fabrication Node 8N |
Die Size 200mm² | Die Size 276mm² |
Transistor Count 8.7 Billion | Transistor Count 13.3 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 48.01 MTr/mm² |
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