GPUs

NVIDIA GeForce RTX 3050 Laptop 50W vs NVIDIA Quadro RTX 3000 Max-Q Full Specs

2,048 Shaders
1.42GHz
2,304 Shaders
1.22GHz
4GB GDDR6192GB/s
6GB GDDR6416GB/s
··
5.8 TFLOPS
··
5.6 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
50W
TDP
60W

Clock Speed
···
Clock Speed
···
Peak OPS
185.7 TOPSINT4 Tensor Sparse
Peak OPS
11.2 TFLOPSFP16
Tensor FP16-16
23.22 TFLOPS
FP16-16 Tensor Sparse
46.43 TFLOPS
Tensor FP16-32
11.61 TFLOPS
FP16-32 Tensor Sparse
23.22 TFLOPS
-
BF16
5.8 TFLOPS
Tensor BF16
11.61 TFLOPS
BF16 Tensor Sparse
23.22 TFLOPS
-
Tensor TF32
5.8 TFLOPS
Tensor TF32
-
FP32
5.8 TFLOPS
FP32
5.6 TFLOPS
FP64
90.69 GFLOPS
FP64
175 GFLOPS
Tensor INT4
92.86 TOPS
Tensor INT4
-
Tensor INT8
46.43 TOPS
-
Ray
8.75 TOPS
Ray
-
Pixel Rate
45.3 GPixel/s
Pixel Rate
58.3 GPixel/s
Texture Rate
90.7 GTexel/s
Texture Rate
175 GTexel/s

Shaders
2,048 Shaders
Shaders
2,304 Shaders
TMUs
64 TMUs
TMUs
144 TMUs
ROPs
32 ROPs
ROPs
48 ROPs
Tensor Cores
64 T-Cores
Tensor Cores
288 T-Cores
RT Cores
16 RT-Cores
RT Cores
36 RT-Cores
SMs
16 SMs
SMs
36 SMs

Base Clock
1.19GHz
Base Clock
600MHz
Boost Clock
1.42GHz
Boost Clock
1.22GHz

L2 Cache
2MB shared
L2 Cache
4MB shared

4GB GDDR6
6GB GDDR6
Memory Bus
128-bit
Memory Bus
256-bit
Memory Speed
12GT/s
Memory Speed
13GT/s
Memory Bandwidth
192GB/s
Memory Bandwidth
416GB/s
ECC
No
ECC
No

TDP
50W
TDP
60W

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
HDCP 2.2

Encoder Model
NVENC 7
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
Codec
AVC (H.264)
HEVC (H.265)

Decoder Model
NVDEC 5
Decoder Model
NVDEC 4
Codec
MPEG-1
MPEG-2
MPEG-4
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
-

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
Quadro RTX branding
Codename
NV177
Codename
NV166
Chip Variant
GA107-140-A1
Chip Variant
TU106-125-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 11, 2021
Release Date
May 27, 2019

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
12FFN
Die Size
200mm²
Die Size
445mm²
Transistor Count
8.7 Billion
Transistor Count
10.8 Billion
Transistor Density
43.5 MTr/mm²
Transistor Density
24.27 MTr/mm²