NVIDIA GeForce RTX 3050 Ti Laptop 80W vs Intel Arc A730M Full Specs
2,560 Shaders 1.7GHz | 3,072 Shaders 1.1GHz |
4GB GDDR6192GB/s | 12GB GDDR6336GB/s |
·· 8.68 TFLOPS | ·· 6.76 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 80W | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 277.7 TOPSINT4 Tensor Sparse | Peak OPS 216.3 TOPSINT4 Tensor |
FP16 8.68 TFLOPSTensor FP16-16 34.71 TFLOPSFP16-16 Tensor Sparse 69.43 TFLOPSTensor FP16-32 17.36 TFLOPSFP16-32 Tensor Sparse 34.71 TFLOPS | FP16 13.52 TFLOPSTensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 54.07 TFLOPSFP16-32 Tensor Sparse - |
BF16 8.68 TFLOPSTensor BF16 17.36 TFLOPSBF16 Tensor Sparse 34.71 TFLOPS | BF16 -Tensor BF16 54.07 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 8.68 TFLOPS | Tensor TF32 - |
FP32 8.68 TFLOPS | FP32 6.76 TFLOPS |
FP64 135.6 GFLOPS | FP64 1.69 TFLOPS |
Tensor INT4 138.9 TOPS | Tensor INT4 216.3 TOPS |
Tensor INT8 69.43 TOPS | Tensor INT8 108.1 TOPS |
Ray 13.09 TOPS | Ray - |
Pixel Rate 54.2 GPixel/s | Pixel Rate 105.6 GPixel/s |
Texture Rate 135.6 GTexel/s | Texture Rate 211.2 GTexel/s |
Shaders 2,560 Shaders | Shaders 3,072 Shaders |
TMUs 80 TMUs | TMUs 192 TMUs |
ROPs 32 ROPs | ROPs 96 ROPs |
Tensor Cores 80 T-Cores | Tensor Cores 384 T-Cores |
RT Cores 20 RT-Cores | RT Cores 24 RT-Cores |
SMs 20 SMs | EUs 384 EUs |
Base Clock 1.46GHz | Base Clock 300MHz |
Boost Clock 1.7GHz | Boost Clock 1.1GHz |
L1 64KB/SM Tex | L1 192KB/Xe-core |
L2 Cache 2MB shared | L2 Cache 8MB shared |
4GB GDDR6 | 12GB GDDR6 |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 12GT/s | Memory Speed 14GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 336GB/s |
ECC No | ECC No |
TDP 80W | TDP 80W |
Max Resolution 7680x4320 | Max Resolution 7680x4320 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 3 | Multi-Monitor 4 |
Adaptive Sync G-Sync FreeSync | Adaptive Sync - FreeSync |
DSC Supported | DSC - |
HDCP HDCP 2.3 | HDCP - |
Shader Model 6.6 | Shader Model 6.6 |
DirectX DirectX 12Direct3D 12_2 | DirectX DirectX 12Direct3D 12_2 |
OpenGL 4.6OpenCL 3Vulkan 1.2 | OpenGL 4.6OpenCL 3Vulkan 1.3 |
CUDA 8.6PureVideo HD VP11VDPAU Feature Set K | - |
Encoder NVENC 7 | Encoder Arc |
Codec - - AVC (H.264) HEVC (H.265) - | Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1 |
Decoder NVDEC 5 | Decoder Arc |
Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 | Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
PCIe PCIe 4.0 x8 | PCIe PCIe 4.0 x16 |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Xe HPG |
Chip Variant GA107-140-A1 | Chip Variant DG2-512 |
Market Segment Laptop | Market Segment Laptop |
Release Date May 11, 2021 | Release Date Jun 28, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 200mm² | Die Size 406mm² |
Transistor Count 8.7B | Transistor Count 21.7B |
Transistor Density 43.5 MTr/mm² | Transistor Density 53.45 MTr/mm² |





