GPUs

NVIDIA GeForce RTX 3050 vs Intel UHD 730 1300MHz Full Specs

2,560 Shaders
1.78GHz
192 Shaders
1.3GHz
8GB GDDR6224GB/s
Shared Memory51.2GB/sDDR4
··
9.1 TFLOPS
··
499.2 GFLOPS
Form Factor
PCIe Card
Form Factor
iGPU
TDP
115W
TDP
Shared
Power Connectors
1x 12-Pin
Power Connectors
-

GeForce RTX 3050GeForce RTX 3050291.1 TOPSINT4 Tensor Sparse
x291.61
UHD 730 1300MHzUHD 730 1300MHz998.4 GFLOPSFP16
x1

Clock Speed
···
Clock Speed
··
Peak OPS
291.1 TOPSINT4 Tensor Sparse
Peak OPS
998.4 GFLOPSFP16
Tensor FP16-16
36.39 TFLOPS
FP16-16 Tensor Sparse
72.79 TFLOPS
Tensor FP16-32
18.2 TFLOPS
FP16-32 Tensor Sparse
36.39 TFLOPS
-
BF16
9.1 TFLOPS
Tensor BF16
18.2 TFLOPS
BF16 Tensor Sparse
36.39 TFLOPS
-
Tensor TF32
9.1 TFLOPS
Tensor TF32
-
FP32
9.1 TFLOPS
FP32
499.2 GFLOPS
FP64
142.2 GFLOPS
FP64
124.8 GFLOPS
Tensor INT4
145.6 TOPS
Tensor INT4
-
Tensor INT8
72.79 TOPS
-
Ray
13.72 TOPS
Ray
-
Pixel Rate
56.9 GPixel/s
Pixel Rate
10.4 GPixel/s
Texture Rate
142.2 GTexel/s
Texture Rate
15.6 GTexel/s

Shaders
2,560 Shaders
Shaders
192 Shaders
TMUs
80 TMUs
TMUs
12 TMUs
ROPs
32 ROPs
ROPs
8 ROPs
Tensor Cores
80 T-Cores
Tensor Cores
-
RT Cores
20 RT-Cores
RT Cores
-
SMs
20 SMs
EUs
24 EUs

Base Clock
1.55GHz
Base Clock
-
Boost Clock
1.78GHz
Boost Clock
1.3GHz

L2 Cache
2MB shared
L2 Cache
-

8GB GDDR6
Shared MemoryDDR4
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
3.2GT/s
Memory Bandwidth
224GB/s
Memory Bandwidth
51.2GB/s
ECC
No
ECC
No

TDP
115W
TDP
Shared

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
-

3x DisplayPort 1.4
-
1x HDMI 2.1
-

Encoder Model
NVENC 7
Encoder Model
Quick Sync Video 7

Decoder Model
NVDEC 5
Decoder Model
Quick Sync Video 7

Form Factor
PCIe Card
Form Factor
iGPU
PCIe
1.9-Slots
PCIe
-
Height
112 mm (4.41")
Width
242 mm (9.53")
Depth
38 mm (1.5")
-
Cooling
Open-Air
2x Fans
Cooling
Passive
-
Power Connectors
1x 12-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
UHD 2020 branding
Codename
NV177
Codename
Xe LP
Chip Variant
GA107-140-A1
Chip Variant
GT1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Dec 16, 2022
Release Date
Mar 16, 2021

Foundry
Samsung
Foundry
Intel
Fabrication Node
8N
Fabrication Node
14nm++++
Die Size
200mm²
Die Size
276mm²
Transistor Count
8.7 Billion
Transistor Count
6.9 Billion
Transistor Density
43.5 MTr/mm²
Transistor Density
25 MTr/mm²

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