NVIDIA GeForce RTX 3060 Laptop 80W vs NVIDIA GeForce RTX 2070 Super Max-Q Full Specs
3,840 Shaders 1.43GHz | 2,560 Shaders 1.16GHz |
6GB GDDR6336GB/s | 8GB GDDR6384GB/s |
·· 10.94 TFLOPS | ·· 5.91 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 80W | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 350.2 TOPSINT4 Tensor Sparse | Peak OPS 189.2 TOPSINT4 Tensor |
Tensor FP16-16 43.78 TFLOPSFP16-16 Tensor Sparse 87.55 TFLOPSTensor FP16-32 21.89 TFLOPSFP16-32 Tensor Sparse 43.78 TFLOPS | Tensor FP16-16 47.31 TFLOPSFP16-16 Tensor Sparse -Tensor FP16-32 23.65 TFLOPSFP16-32 Tensor Sparse - |
BF16 10.94 TFLOPSTensor BF16 21.89 TFLOPSBF16 Tensor Sparse 43.78 TFLOPS | BF16 -Tensor BF16 23.65 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 10.94 TFLOPS | Tensor TF32 23.65 TFLOPS |
FP32 10.94 TFLOPS | FP32 5.91 TFLOPS |
FP64 171 GFLOPS | FP64 184.8 GFLOPS |
Tensor INT4 175.1 TOPS | Tensor INT4 189.2 TOPS |
Tensor INT8 87.55 TOPS | Tensor INT8 94.62 TOPS |
Ray 16.51 TOPS | Ray 17.84 TOPS |
Pixel Rate 68.4 GPixel/s | Pixel Rate 73.9 GPixel/s |
Texture Rate 171 GTexel/s | Texture Rate 184.8 GTexel/s |
Shaders 3,840 Shaders | Shaders 2,560 Shaders |
TMUs 120 TMUs | TMUs 160 TMUs |
ROPs 48 ROPs | ROPs 64 ROPs |
Tensor Cores 120 T-Cores | Tensor Cores 320 T-Cores |
RT Cores 30 RT-Cores | RT Cores 40 RT-Cores |
SMs 30 SMs | SMs 40 SMs |
Base Clock 900MHz | Base Clock 930MHz |
Boost Clock 1.43GHz | Boost Clock 1.16GHz |
L2 Cache 3MB shared | L2 Cache 4MB shared |
6GB GDDR6 | 8GB GDDR6 |
Memory Bus 192-bit | Memory Bus 256-bit |
Memory Speed 14GT/s | Memory Speed 12GT/s |
Memory Bandwidth 336GB/s | Memory Bandwidth 384GB/s |
ECC No | ECC No |
TDP 80W | TDP 80W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.2 |
Encoder Model NVENC 7 | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) | Codec AVC (H.264) HEVC (H.265) |
Decoder Model NVDEC 5 | Decoder Model NVDEC 4 |
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) - |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV176 | Codename NV164 |
Chip Variant GA106-150-KA-A1 | Chip Variant TU104-150-KC-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Feb 25, 2021 | Release Date Apr 2, 2020 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node 12FFN |
Die Size 276mm² | Die Size 545mm² |
Transistor Count 13.3 Billion | Transistor Count 13.6 Billion |
Transistor Density 48.01 MTr/mm² | Transistor Density 24.95 MTr/mm² |
