NVIDIA GeForce RTX 3080 Laptop 90W vs Intel Arc 130V 1850MHz Full Specs
6,144 Shaders 1.36GHz | 896 Shaders 1.85GHz |
8GB GDDR6384GB/s placeholder | Shared Memory136.5GB/sLPDDR5X |
·· 16.77 TFLOPS | ·· 3.31 TFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 90W | TDP Shared |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 536.7 TOPSINT4 Tensor Sparse | Peak OPS 106.1 TOPSINT4 Tensor |
Tensor FP16-16 67.09 TFLOPSFP16-16 Tensor Sparse 134.2 TFLOPSTensor FP16-32 33.55 TFLOPSFP16-32 Tensor Sparse 67.09 TFLOPS | Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 26.52 TFLOPSFP16-32 Tensor Sparse - |
BF16 16.77 TFLOPSTensor BF16 33.55 TFLOPSBF16 Tensor Sparse 67.09 TFLOPS | BF16 -Tensor BF16 26.52 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 16.77 TFLOPS | Tensor TF32 - |
FP32 16.77 TFLOPS | FP32 3.31 TFLOPS |
FP64 262.1 GFLOPS | FP64 828.8 GFLOPS |
Tensor INT4 268.4 TOPS | Tensor INT4 106.1 TOPS |
Tensor INT8 134.2 TOPS | Tensor INT8 53.04 TOPS |
Ray 25.3 TOPS | Ray - |
Pixel Rate 131 GPixel/s | Pixel Rate 51.8 GPixel/s |
Texture Rate 262.1 GTexel/s | Texture Rate 103.6 GTexel/s |
Shaders 6,144 Shaders | Shaders 896 Shaders |
TMUs 192 TMUs | TMUs 56 TMUs |
ROPs 96 ROPs | ROPs 28 ROPs |
Tensor Cores 192 T-Cores | Tensor Cores 56 T-Cores |
RT Cores 48 RT-Cores | RT Cores 7 RT-Cores |
SMs 48 SMs | EUs 56 EUs |
Base Clock 930MHz | Base Clock - |
Boost Clock 1.36GHz | Boost Clock 1.85GHz |
L2 Cache 4MB shared | L2 Cache 7MB shared |
8GB GDDR6 placeholder | Shared MemoryLPDDR5X |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 12GT/s | Memory Speed 8.5GT/s |
Memory Bandwidth 384GB/s | Memory Bandwidth 136.5GB/s |
ECC No | ECC No |
TDP 90W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 7 | Encoder Model Xe Media Engine |
Codec - AVC (H.264) HEVC (H.265) - | Codec VP9 AVC (H.264) HEVC (H.265) AV1 |
Decoder Model NVDEC 5 | Decoder Model Xe Media Engine |
Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) - AV1 | Codec - MPEG-2 - JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) VVC (H.266) AV1 |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV174 | Codename Xe2 LPG |
Chip Variant GA104-150-A1 | Chip Variant GT2 |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 12, 2021 | Release Date Sep 3, 2024 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N3B |
Die Size 393mm² | Die Size 140mm² |
Transistor Count 17.4 Billion | Transistor Count - |
Transistor Density 44.33 MTr/mm² | Transistor Density - |

