NVIDIA GeForce RTX 4070 Laptop 80W vs Qualcomm Adreno 642 Full Specs
4,608 Shaders 1.7GHz | 768 Shaders 550MHz |
8GB GDDR6256GB/s placeholder | Shared Memory25.6GB/s · |
·· 15.62 TFLOPS | ·· 844.8 GFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 80W | TDP 5W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 499.9 TOPSINT4 Tensor Sparse | Peak OPS 1.69 TFLOPSFP16 |
Tensor FP8-16 125 TFLOPSFP8-16 Tensor Sparse 249.9 TFLOPSTensor FP8-32 62.48 TFLOPSFP8-32 Tensor Sparse 125 TFLOPS | - |
Tensor FP16-16 62.48 TFLOPSFP16-16 Tensor Sparse 125 TFLOPSTensor FP16-32 31.24 TFLOPSFP16-32 Tensor Sparse 62.48 TFLOPS | - |
BF16 15.62 TFLOPSTensor BF16 31.24 TFLOPSBF16 Tensor Sparse 62.48 TFLOPS | - |
Tensor TF32 15.62 TFLOPS | Tensor TF32 - |
FP32 15.62 TFLOPS | FP32 844.8 GFLOPS |
FP64 244.1 GFLOPS | FP64 211.2 GFLOPS |
Tensor INT4 249.9 TOPS | Tensor INT4 - |
Tensor INT8 125 TOPS | - |
Ray 36.11 TOPS | Ray - |
Pixel Rate 81.4 GPixel/s | Pixel Rate 13.2 GPixel/s |
Texture Rate 244.1 GTexel/s | Texture Rate 26.4 GTexel/s |
Shaders 4,608 Shaders | Shaders 768 Shaders |
TMUs 144 TMUs | TMUs 48 TMUs |
ROPs 48 ROPs | ROPs 24 ROPs |
Tensor Cores 144 T-Cores | Tensor Cores - |
RT Cores 36 RT-Cores | RT Cores - |
SMs 36 SMs | EUs 6 EUs |
Base Clock 1.4GHz | Base Clock 490MHz |
Boost Clock 1.7GHz | Boost Clock 550MHz |
L1 64KB/SM Tex | L1 8KB/CU |
L2 Cache 32MB shared | L2 Cache 128KB shared |
L3 Cache - | L3 Cache 2MB shared |
8GB GDDR6 placeholder | Shared Memory · |
Memory Bus 128-bit | Memory Bus 32-bit |
Memory Speed 16GT/s | Memory Speed 6.4GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 25.6GB/s |
ECC No | ECC No |
TDP 80W | TDP 5W |
Max Resolution 7680x4320 | Max Resolution 2520x1080 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 1920x1080 Resolution1080p FHD Refresh Rate 78Hz |
Multi-Monitor 4 | Multi-Monitor 1 |
Adaptive Sync G-Sync FreeSync | Adaptive Sync - |
DSC Supported | DSC Not Supported |
HDCP HDCP 2.3 | HDCP - |
Shader Model 6.6 | Shader Model - |
DirectX DirectX 12Direct3D 12_3 | DirectX DirectX 12Direct3D 12_1 |
OpenGL 4.6OpenCL 3Vulkan 1.3 | OpenGL 3.2OpenCL 2Vulkan 1.1 |
CUDA 8.9PureVideo HD VP12VDPAU Feature Set L | - |
Encoder NVENC 8 | Encoder Hexagon 770 |
Codec - - - - - AVC (H.264) HEVC (H.265) AV1 | Codec H.263 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) - |
Decoder NVDEC 5 | Decoder Hexagon 770 |
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) - |
Form Factor Soldered | Form Factor iGPU |
PCIe PCIe 4.0 x16 | PCIe - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV186 | Codename - |
Chip Variant AD106-350-A1 | Chip Variant - |
Market Segment Laptop | Market Segment Smartphone |
Release Date Feb 22, 2023 | Release Date May 20, 2022 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 4N | Fabrication Node N6 |
Die Size 188mm² | Die Size - |
Transistor Count 22.9B | Transistor Count - |
Transistor Density 121.8 MTr/mm² | Transistor Density - |





