NVIDIA GeForce RTX 4090 Laptop 110W vs Qualcomm Adreno 810 Full Specs
9,728 Shaders 1.5GHz | 256 Shaders 1.05GHz |
16GB GDDR6576GB/s placeholder | Shared Memory25.6GB/s · |
·· 29.28 TFLOPS | ·· 537.6 GFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 110W | TDP 5W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 937 TOPSINT4 Tensor Sparse | Peak OPS 1.07 TFLOPSFP16 |
Tensor FP8-16 234.3 TFLOPSFP8-16 Tensor Sparse 468.5 TFLOPSTensor FP8-32 117.1 TFLOPSFP8-32 Tensor Sparse 234.3 TFLOPS | - |
Tensor FP16-16 117.1 TFLOPSFP16-16 Tensor Sparse 234.3 TFLOPSTensor FP16-32 58.56 TFLOPSFP16-32 Tensor Sparse 117.1 TFLOPS | - |
BF16 29.28 TFLOPSTensor BF16 58.56 TFLOPSBF16 Tensor Sparse 117.1 TFLOPS | BF16 1.07 TFLOPSTensor BF16 -BF16 Tensor Sparse - |
Tensor TF32 29.28 TFLOPS | Tensor TF32 - |
FP32 29.28 TFLOPS | FP32 537.6 GFLOPS |
FP64 457.5 GFLOPS | FP64 134.4 GFLOPS |
Tensor INT4 468.5 TOPS | Tensor INT4 - |
Tensor INT8 234.3 TOPS | - |
Ray 67.68 TOPS | Ray - |
Pixel Rate 168.6 GPixel/s | Pixel Rate 8.4 GPixel/s |
Texture Rate 457.5 GTexel/s | Texture Rate 16.8 GTexel/s |
Shaders 9,728 Shaders | Shaders 256 Shaders |
TMUs 304 TMUs | TMUs 16 TMUs |
ROPs 112 ROPs | ROPs 8 ROPs |
Tensor Cores 304 T-Cores | Tensor Cores - |
RT Cores 76 RT-Cores | RT Cores - |
SMs 76 SMs | EUs 2 EUs |
Base Clock 1.46GHz | Base Clock 895MHz |
Boost Clock 1.5GHz | Boost Clock 1.05GHz |
L1 64KB/SM Tex | L1 - |
L2 Cache 64MB shared | L2 Cache - |
16GB GDDR6 placeholder | Shared Memory · |
Memory Bus 256-bit | Memory Bus 32-bit |
Memory Speed 18GT/s | Memory Speed 6.4GT/s |
Memory Bandwidth 576GB/s | Memory Bandwidth 25.6GB/s |
ECC No | ECC No |
TDP 110W | TDP 5W |
Max Resolution 7680x4320 | Max Resolution 3840x2160 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz |
Multi-Monitor 4 | Multi-Monitor 1 |
Adaptive Sync G-Sync FreeSync | Adaptive Sync - |
DSC Supported | DSC Not Supported |
HDCP HDCP 2.3 | HDCP - |
Shader Model 6.6 | Shader Model - |
DirectX DirectX 12Direct3D 12_3 | DirectX DirectX 12Direct3D 12_1 |
OpenGL 4.6OpenCL 3Vulkan 1.3 | OpenGL 3.2OpenCL 2Vulkan 1.3 |
CUDA 8.9PureVideo HD VP12VDPAU Feature Set L | - |
Encoder 2x NVENC 8 | Encoder Hexagon |
Codec - - - - - AVC (H.264) HEVC (H.265) AV1 | Codec H.263 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) - |
Decoder NVDEC 5 | Decoder Hexagon AV1 |
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor iGPU |
PCIe PCIe 4.0 x16 | PCIe - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV183 | Codename - |
Chip Variant AD103-275-A1 | Chip Variant - |
Market Segment Laptop | Market Segment Smartphone |
Release Date Feb 8, 2023 | Release Date Oct 1, 2024 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 4N | Fabrication Node N6 |
Die Size 379mm² | Die Size - |
Transistor Count 45.9B | Transistor Count - |
Transistor Density 121.2 MTr/mm² | Transistor Density - |





