NVIDIA Quadro P620 vs Apple 4-Core A19 Full Specs

Summary

512 Shaders 1.35GHz	512 Shaders 1.47GHz
2GB GDDR564.2GB/s placeholder	Shared Memory68.3GB/sLPDDR5X
Peak·FP32·FP16 1.39 TFLOPS	Peak·FP32·FP16 1.5 TFLOPS
Form Factor PCIe Card	Form Factor iGPU
TDP 40W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP8-16 Tensor FP8-32 Tensor FP16-16 Tensor FP16-32 FP64 Memory Bandwidth TDP

Quadro P6201.39 TFLOPSFP32

x1

4-Core A193.01 TFLOPSFP8-16 Tensor

x2.17

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Theoretical Performance

Clock Speed1354MHz UC·Base·Boost·OC	Clock Speed1470MHz UC·Boost·OC
Peak OPS 1.39 TFLOPSFP32	Peak OPS 3.01 TFLOPSFP8-16 Tensor
-	Tensor FP8-16 3.01 TFLOPS Tensor FP8-32 3.01 TFLOPS
-	Tensor FP16-16 1.5 TFLOPS Tensor FP16-32 1.5 TFLOPS
FP32 1.39 TFLOPS	FP32 1.5 TFLOPS
FP64 43.33 GFLOPS	-
Pixel Rate 21.7 GPixel/s	Pixel Rate 23.5 GPixel/s
Texture Rate 43.3 GTexel/s	Texture Rate 47 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 512 Shaders
TMUs 32 TMUs	TMUs 32 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 4 T-Cores
RT Cores -	RT Cores 4 RT-Cores
SMs 4 SMs	EUs 64 EUs

Clocks

Base Clock 1.27GHz	Base Clock -
Boost Clock 1.35GHz	Boost Clock 1.47GHz

Cache

L2 Cache 768KB shared

L2 Cache 1MB shared

Memory

2GB GDDR5 placeholder	Shared MemoryLPDDR5X
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 4GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 64.2GB/s	Memory Bandwidth 68.3GB/s
ECC No	ECC No

Power & Thermals

TDP 40W

TDP Shared

Video Output

Multi-Monitor 3

Multi-Monitor 1

Ports

4x Mini DisplayPort 1.4

-

Encoder

Encoder Model NVENC 4

Encoder Model Apple Media Engine 3

Decoder

Decoder Model NVDEC 3

Decoder Model Apple Media Engine 3

Card

Form Factor PCIe Card	Form Factor iGPU
PCIe 1-Slots	PCIe -
Height 69 mm (2.72") Width 150 mm (5.91") Depth 20 mm (0.79")	-
Cooling Blower 1x Fan	Cooling Open-Air -

Chip

Manufacturer NVIDIA	Manufacturer Apple
Chip Designer NVIDIA	Chip Designer Apple
Architecture Pascal	Architecture Apple Gen 8
Family Quadro P	Family A Series
Branding	Branding
Codename NV137	Codename G18A
Chip Variant GP107-300-A1	Chip Variant -
Market Segment Workstation	Market Segment Smartphone
Release Date Feb 1, 2018	Release Date Mar 2, 2026

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N3P
Die Size 132mm²	Die Size 83mm²
Transistor Count 3.3 Billion	Transistor Count 14.3 Billion
Transistor Density 25 MTr/mm²	Transistor Density 172 MTr/mm²

Images

No images available

No images available

Used In

CPUs -	CPUs A19 (17e)
Smartphones -	Smartphones iPhone 17e

Competitors

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Apple4-Core A19 vs GPU Apple5-Core A18 Pro Apple4-Core A19 vs GPU Apple5-Core A19 Pro Apple4-Core A19 vs GPU Apple5-Core A19 Show 11 more