NVIDIA T4 vs MSI GeForce RTX 3050 LP 6G OC Full Specs
2,560 Shaders 1.59GHz | 2,304 Shaders 1.49GHz |
16GB GDDR6160GB/s | 6GB GDDR6168GB/s |
·· 8.14 TFLOPS | ·· 6.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 70W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 260.5 TOPSINT4 Tensor | Peak OPS 220 TOPSINT4 Tensor Sparse |
Tensor FP16-16 65.13 TFLOPSFP16-16 Tensor Sparse -Tensor FP16-32 32.56 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 27.5 TFLOPSFP16-16 Tensor Sparse 55 TFLOPSTensor FP16-32 13.75 TFLOPSFP16-32 Tensor Sparse 27.5 TFLOPS |
BF16 -Tensor BF16 32.56 TFLOPSBF16 Tensor Sparse - | BF16 6.88 TFLOPSTensor BF16 13.75 TFLOPSBF16 Tensor Sparse 27.5 TFLOPS |
Tensor TF32 32.56 TFLOPS | Tensor TF32 6.88 TFLOPS |
FP32 8.14 TFLOPS | FP32 6.88 TFLOPS |
FP64 254.4 GFLOPS | FP64 107.4 GFLOPS |
Tensor INT4 260.5 TOPS | Tensor INT4 110 TOPS |
Tensor INT8 130.3 TOPS | Tensor INT8 55 TOPS |
Ray 24.56 TOPS | Ray 10.37 TOPS |
Pixel Rate 101.8 GPixel/s | Pixel Rate 47.7 GPixel/s |
Texture Rate 254.4 GTexel/s | Texture Rate 107.4 GTexel/s |
Shaders 2,560 Shaders | Shaders 2,304 Shaders |
TMUs 160 TMUs | TMUs 72 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 320 T-Cores | Tensor Cores 72 T-Cores |
RT Cores 40 RT-Cores | RT Cores 18 RT-Cores |
SMs 40 SMs | SMs 18 SMs |
Base Clock 585MHz | Base Clock 1.04GHz |
Boost Clock 1.59GHz | Boost Clock 1.49GHz |
L2 Cache 4.1MB shared | L2 Cache 2MB shared |
16GB GDDR6 | 6GB GDDR6 |
Memory Bus 256-bit | Memory Bus 96-bit |
Memory Speed 5GT/s | Memory Speed 14GT/s |
Memory Bandwidth 160GB/s | Memory Bandwidth 168GB/s |
TDP 70W | TDP 70W |
Multi-Monitor - | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 1x DisplayPort 1.4 |
- | 2x HDMI 2.1 |
Encoder Model NVENC 7 | Encoder Model NVENC 7 |
Decoder Model NVDEC 4 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 69 mm (2.72")Width 168 mm (6.61")Depth 20 mm (0.79") | Height 69 mm (2.72")Width 174 mm (6.85")Depth 40 mm (1.57") |
Cooling Passive - | Cooling Open-Air 2x Fans |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV164 | Codename NV177 |
Chip Variant TU104-150-KC-A1 | Chip Variant GA107-140-A1 |
Market Segment Server | Market Segment Desktop |
Release Date Sep 13, 2018 | Release Date Feb 2, 2024 |
Foundry TSMC | Foundry Samsung |
Fabrication Node 12FFN | Fabrication Node 8N |
Die Size 545mm² | Die Size 200mm² |
Transistor Count 13.6 Billion | Transistor Count 8.7 Billion |
Transistor Density 24.95 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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