GPUs

Qualcomm Adreno 225 vs Qualcomm Adreno 830 Full Specs

32 Shaders
400MHz
1,536 Shaders
1.1GHz
Shared Memory8GB/sLPDDR2
Shared Memory84.8GB/sLPDDR5X
··
25.6 GFLOPS
··
3.38 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
5W
TDP
5W

Adreno 225Adreno 22551.2 GFLOPSFP16
x1
Adreno 830Adreno 8306.76 TFLOPSFP16
x132.00

Clock Speed
···
Clock Speed
··
Peak OPS
51.2 GFLOPSFP16
Peak OPS
6.76 TFLOPSFP16
-
BF16
6.76 TFLOPS
FP32
25.6 GFLOPS
FP32
3.38 TFLOPS
FP64
6.4 GFLOPS
FP64
844.8 GFLOPS
Pixel Rate
0.8 GPixel/s
Pixel Rate
52.8 GPixel/s
Texture Rate
0.8 GTexel/s
Texture Rate
105.6 GTexel/s

Shaders
32 Shaders
Shaders
1,536 Shaders
TMUs
2 TMUs
TMUs
96 TMUs
ROPs
2 ROPs
ROPs
48 ROPs
Units
-
EUs
12 EUs

Base Clock
200MHz
Base Clock
-
Boost Clock
400MHz
Boost Clock
1.1GHz

L2 Cache
512KB shared
L2 Cache
1MB shared
L3 Cache
-
L3 Cache
4MB shared

Shared MemoryLPDDR2
Shared MemoryLPDDR5X
Memory Bus
64-bit
Memory Bus
64-bit
Memory Speed
1GT/s
Memory Speed
10.6GT/s
Memory Bandwidth
8GB/s
Memory Bandwidth
84.8GB/s
ECC
No
ECC
No

TDP
5W
TDP
5W

Multi-Monitor
1
Multi-Monitor
1

Encoder Model
QDSP6
Encoder Model
Hexagon

Decoder Model
QDSP6
Decoder Model
Hexagon AV1

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Adreno branding
Branding
Adreno branding
Codename
Leia
Codename
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jul 1, 2012
Release Date
Oct 1, 2024

Foundry
Samsung
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N3E
Die Size
-
Die Size
124mm²

No images available
No images available