Qualcomm Adreno 702 vs Apple S9 Full Specs
256 Shaders 845MHz | 128 Shaders 440MHz |
Shared Memory8.5GB/sLPDDR4 | Shared Memory25.6GB/sLPDDR5 |
·· 432.6 GFLOPS | ·· 112.6 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP 5W | TDP Shared |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 865.3 GFLOPSFP16 | Peak OPS 112.6 GFLOPSFP16 |
FP32 432.6 GFLOPS | FP32 112.6 GFLOPS |
FP64 108.2 GFLOPS | - |
Pixel Rate 6.8 GPixel/s | Pixel Rate 1.8 GPixel/s |
Texture Rate 13.5 GTexel/s | Texture Rate 3.5 GTexel/s |
Shaders 256 Shaders | Shaders 128 Shaders |
TMUs 16 TMUs | TMUs 8 TMUs |
ROPs 8 ROPs | ROPs 4 ROPs |
EUs 2 EUs | EUs 16 EUs |
Boost Clock 845MHz | Boost Clock 440MHz |
Shared MemoryLPDDR4 | Shared MemoryLPDDR5 |
Memory Bus 16-bit | Memory Bus 32-bit |
Memory Speed 4.3GT/s | Memory Speed 6.4GT/s |
Memory Bandwidth 8.5GB/s | Memory Bandwidth 25.6GB/s |
ECC No | ECC No |
TDP 5W | TDP Shared |
Multi-Monitor 1 | Multi-Monitor 1 |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename - | Codename G15M |
Market Segment Smartphone | Market Segment Smartwatch |
Release Date Aug 1, 2022 | Release Date Sep 12, 2023 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 28nm LP | Fabrication Node N4P |
Die Size - | Die Size 41mm² |
Transistor Count - | Transistor Count 5.6 Billion |
Transistor Density - | Transistor Density 135 MTr/mm² |