Qualcomm Adreno 830 vs Apple 6-Core A17 Pro Full Specs

Summary

1,536 Shaders 1.1GHz	768 Shaders 1.34GHz
Shared Memory84.8GB/sLPDDR5X	Shared Memory51.2GB/sLPDDR5
Peak·FP32·FP16 3.38 TFLOPS	Peak·FP32·FP16 2.06 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP 5W	TDP Shared

Theoretical Performance

Clock Speed1100MHz UC·Boost·OC	Clock Speed1338MHz UC·Boost·OC
Peak OPS 6.76 TFLOPSFP16	Peak OPS 2.06 TFLOPSFP16
BF16 6.76 TFLOPS	-
FP32 3.38 TFLOPS	FP32 2.06 TFLOPS
FP64 844.8 GFLOPS	-
Pixel Rate 52.8 GPixel/s	Pixel Rate 32.1 GPixel/s
Texture Rate 105.6 GTexel/s	Texture Rate 64.2 GTexel/s

Core Config

Shaders 1,536 Shaders	Shaders 768 Shaders
TMUs 96 TMUs	TMUs 48 TMUs
ROPs 48 ROPs	ROPs 24 ROPs
RT Cores -	RT Cores 6 RT-Cores
EUs 12 EUs	EUs 96 EUs

Clocks

Boost Clock 1.1GHz

Boost Clock 1.34GHz

Cache

L2 Cache 1MB shared	L2 Cache 768KB shared
L3 Cache 4MB shared	L3 Cache -

Memory

Shared MemoryLPDDR5X	Shared MemoryLPDDR5
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 10.6GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 84.8GB/s	Memory Bandwidth 51.2GB/s
ECC No	ECC No

Power & Thermals

TDP 5W

TDP Shared

Video Output

Max Resolution 3840x2160	Max Resolution 3840x2160
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz	Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz
Multi-Monitor 1	Multi-Monitor 1
DSC Not Supported	DSC Not Supported

API Support

DirectX DirectX 12 Direct3D 12_1	-
OpenGL 3.2 OpenCL 2 Vulkan 1.3	-

Encoder

Encoder Hexagon	Encoder Apple Media Engine 3
Codec H.263 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) -	Codec - - - - - AVC (H.264) HEVC (H.265) ProRes

Decoder

Decoder Hexagon AV1	Decoder Apple Media Engine 3
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 -	Codec - - - - - - AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Qualcomm	Manufacturer Apple
Chip Designer Qualcomm	Chip Designer Apple
Architecture Adreno 800	Architecture Apple Gen 6
Family Adreno 800	Family A Series
Branding	Branding
Codename -	Codename G16P
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 1, 2024	Release Date Sep 12, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N3B
Die Size 124mm²	Die Size 104mm²
Transistor Count -	Transistor Count 19B
Transistor Density -	Transistor Density 183 MTr/mm²

Images