GPUs

Qualcomm Adreno 830 vs Qualcomm Adreno 330 Full Specs

1,536 Shaders
1.1GHz
128 Shaders
450MHz
Shared Memory84.8GB/sLPDDR5X
Shared Memory12.8GB/sLPDDR3
··
3.38 TFLOPS
··
115.2 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
5W
TDP
5W

Adreno 830Adreno 8306.76 TFLOPSFP16
x29.33
Adreno 330Adreno 330230.4 GFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
6.76 TFLOPSFP16
Peak OPS
230.4 GFLOPSFP16
BF16
6.76 TFLOPS
-
FP32
3.38 TFLOPS
FP32
115.2 GFLOPS
FP64
844.8 GFLOPS
FP64
28.8 GFLOPS
Pixel Rate
52.8 GPixel/s
Pixel Rate
3.6 GPixel/s
Texture Rate
105.6 GTexel/s
Texture Rate
3.6 GTexel/s

Shaders
1,536 Shaders
Shaders
128 Shaders
TMUs
96 TMUs
TMUs
8 TMUs
ROPs
48 ROPs
ROPs
8 ROPs
EUs
12 EUs
Units
-

Boost Clock
1.1GHz
Boost Clock
450MHz

L2 Cache
1MB shared
L2 Cache
1MB shared
L3 Cache
4MB shared
L3 Cache
-

Shared MemoryLPDDR5X
Shared MemoryLPDDR3
Memory Bus
64-bit
Memory Bus
64-bit
Memory Speed
10.6GT/s
Memory Speed
1.6GT/s
Memory Bandwidth
84.8GB/s
Memory Bandwidth
12.8GB/s
ECC
No
ECC
No

TDP
5W
TDP
5W

Multi-Monitor
1
Multi-Monitor
1

Encoder Model
Hexagon
Encoder Model
QDSP6

Decoder Model
Hexagon AV1
Decoder Model
QDSP6

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Adreno branding
Branding
Adreno branding
Codename
-
Codename
Oxili
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 1, 2024
Release Date
Aug 1, 2013

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3E
Fabrication Node
28nm HPM
Die Size
124mm²
Die Size
-

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