Storage

Storage Comparison

Capacity
256GB
Sequential Read
730MB/s
Sequential Write
670MB/s
Form Factor
Apple 12+16 Pin
Interface
PCIe
Protocol
AHCI
Controller
UAX
NAND
MLC

Capacity
256GB

Sequential Read
730MB/s
Sequential Write
670MB/s
Rand Read IOPS
120K IOPS
Rand Write IOPS
60K IOPS

Form Factor
Apple 12+16 Pin

Interface
PCIe 2.0 x2
Protocol
AHCI

Designer
Samsung
Model
UAX
Part Number
S4LN053X01
Foundry
Samsung
Process Node
32nm
Cores
3
Clock
300 MHz

DRAM Size
256MB
DRAM Type
LPDDR2
DRAM Bus Width
32-bit
Speed
2133MT/s
DRAM Bandwidth
8.53GB/s

Manufacturer
Samsung
Process Node
19nm
Type
MLC
Die Size
130mm²
Die Capacity
64Gbit
Die Bit Density
0.49Gbit/mm²
NAND Chip Count
8
NAND Die Count
32
NAND Dies/Chip
4

Write Endurance
37TBW
MTBF
1.5M hours

Avg Power
5.8W
Idle Power
80mW

Height
24 mm (0.94")
Width
90 mm (3.54")
Depth
2.4 mm (0.09")

Manufacturer
Apple
Model
Gen 3
Description
256GB Apple 12+16 Pin
Part Number
SM0256F
Part Number 2
MZ-JPU256

No images available