Apple Gen 3

Gen 3

512GB Apple 12+16 Pin

Storage Comparison

Capacity
512GB
Sequential Read
730MB/s
Sequential Write
680MB/s
Form Factor
Apple 12+16 Pin
Interface
PCIe
Protocol
AHCI
Controller
UAX
NAND
MLC

Gen 3Gen 3730MB/s
x1

Capacity
512GB

Sequential Read
730MB/s
Sequential Write
680MB/s
Rand Read IOPS
122K IOPS
Rand Write IOPS
72K IOPS

Form Factor
Apple 12+16 Pin

Interface
PCIe 2.0 x2
Protocol
AHCI

Designer
Samsung
Model
UAX
Part Number
S4LN053X01
Foundry
Samsung
Process Node
32nm
Cores
3
Clock
300MHz

DRAM Size
512MB
DRAM Type
LPDDR2
DRAM Bus Width
32-bit
Speed
2133MT/s

Manufacturer
Samsung
Process Node
19nm
Type
MLC
Die Size
130mm²
Die Capacity
64Gbit
Die Bit Density
0.49Gbit/mm²
NAND Chip Count
8
NAND Die Count
64
NAND Dies/Chip
8

Write Endurance
73TBW
MTBF
1.5M hours

Avg Power
5.8W
Idle Power
80mW

Height
24mm (0.94")
Width
90mm (3.54")
Depth
2.4mm (0.09")

Manufacturer
Apple
Model
Gen 3
Description
512GB Apple 12+16 Pin
Part Number
SM0512F
Part Number 2
MZ-JPU512