BG4
512GB Soldered
Storage Comparison
Capacity 512GB |
Sequential Read 2.2GB/s |
Sequential Write 1.4GB/s |
Form Factor Soldered |
Interface PCIe |
Protocol NVMe |
NAND 3D TLC (96L) |
BG42,200MB/sCapacity 512GB |
Sequential Read 2.2GB/s |
Sequential Write 1.4GB/s |
Rand Read IOPS 330K IOPS |
Rand Write IOPS 190K IOPS |
Form Factor Soldered |
Interface PCIe 3.0 x4 |
Protocol NVMe 1.3 |
Manufacturer Kioxia |
Codename BiCS4 |
Process Node 19nm |
Type 3D TLC (96L) |
Layers 96L |
Die Size 86mm² |
Die Capacity 512Gbit |
Die Bit Density 5.95Gbit/mm² |
NAND Die Count 8 |
MTBF 1.5M hours |
Avg Power 3.1W |
Sleep Power 5mW |
Max Op Temp 85°C |
Min Non-Op Temp -40°C |
Max Non-Op Temp 85°C |
Manufacturer Kioxia |
Model BG4 |
Description 512GB Soldered |
Part Number KBG40ZPZ512G |