Storage Comparison
Capacity 256GB |
Sequential Read 2.3GB/s |
Sequential Write 1.2GB/s |
Form Factor Soldered |
Interface UFS |
NAND 3D TLC (112L) |
Capacity 256GB |
Sequential Read 2.3GB/s |
Sequential Write 1.2GB/s |
Form Factor Soldered |
Interface UFS |
Manufacturer Kioxia |
Codename BiCS5 |
Process Node 19nm |
Type 3D TLC (112L) |
Layers 112L |
Die Size 66mm² |
Die Capacity 512Gbit |
Die Bit Density 7.76Gbit/mm² |
NAND Die Count 4 |
MTBF 1.5M hours |
Min Op Temp -25°C |
Max Op Temp 85°C |
Min Non-Op Temp -40°C |
Max Non-Op Temp 85°C |
Manufacturer Kioxia |
Model THGJFx UFS 3.1 |
Description 256GB Soldered |
Part Number THGJFGT1E45BAIP |
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