Storage Comparison
Capacity 512GB |
Sequential Read 4.6GB/s |
Sequential Write 3GB/s |
Form Factor Soldered |
Interface UFS |
NAND 3D TLC (112L) |
Capacity 512GB |
Sequential Read 4.6GB/s |
Sequential Write 3GB/s |
Form Factor Soldered |
Interface UFS |
Manufacturer Kioxia |
Codename BiCS5 |
Process Node 19nm |
Type 3D TLC (112L) |
Layers 112L |
Die Size 66mm² |
Die Capacity 512Gbit |
Die Bit Density 7.76Gbit/mm² |
NAND Die Count 8 |
MTBF 1.5M hours |
Min Op Temp -25°C |
Max Op Temp 85°C |
Min Non-Op Temp -40°C |
Max Non-Op Temp 85°C |
Manufacturer Kioxia |
Model THGJFx UFS 4.0 |
Description 512GB Soldered |
Part Number THGJFJT2T85BAT0 |
No images available