2300
512GB M.2-2280
Storage Comparison
Capacity 512GB |
Sequential Read 3.3GB/s |
Sequential Write 2.7GB/s |
Form Factor M.2-2280 |
Interface PCIe |
Protocol NVMe |
NAND 3D TLC (96L) |
23003,300MB/sCapacity 512GB |
Sequential Read 3.3GB/s |
Sequential Write 2.7GB/s |
Rand Read IOPS 225K IOPS |
Rand Write IOPS 500K IOPS |
Form Factor M.2-2280 |
M.2 Size 2280 |
M.2 Key M |
M.2 Type S2 |
Interface PCIe 3.0 x4 |
Protocol NVMe 1.3 |
Manufacturer Micron |
Codename B27B |
Process Node 20nm |
Type 3D TLC (96L) |
Layers 96L |
Die Size 82mm² |
Die Capacity 512Gbit |
Die Bit Density 6.26Gbit/mm² |
NAND Die Count 8 |
Write Endurance 300TBW |
MTBF 2M hours |
Avg Power 5.5W |
Idle Power 600mW |
Sleep Power 5mW |
Max Op Temp 70°C |
Min Non-Op Temp -40°C |
Max Non-Op Temp 85°C |
Height 22mm (0.87")Width 80mm (3.15")Depth 2.2mm (0.09") |
Manufacturer Micron |
Model 2300 |
Description 512GB M.2-2280 |
Part Number MTFDHBA512TDV |