2500
512GB M.2-2230
Storage Comparison
Capacity 512GB |
Sequential Read 6.6GB/s |
Sequential Write 3.6GB/s |
Form Factor M.2-2230 |
Interface PCIe |
Protocol NVMe |
NAND 3D QLC (232L) |
25006,600MB/sCapacity 512GB |
Sequential Read 6.6GB/s |
Sequential Write 3.6GB/s |
Rand Read IOPS 530K IOPS |
Rand Write IOPS 860K IOPS |
Form Factor M.2-2230 |
M.2 Size 2230 |
M.2 Key M |
M.2 Type S3 |
Interface PCIe 4.0 x4 |
Protocol NVMe 1.4 |
Manufacturer Micron |
Process Node 20nm |
Type 3D QLC (232L) |
Layers 232L |
Die Size 52mm² |
Die Capacity 1024Gbit |
Die Bit Density 19.78Gbit/mm² |
NAND Chip Count 1 |
NAND Die Count 4 |
NAND Dies/Chip 4 |
AES-128 No |
AES-256 No |
TCG Opal 2.0 Yes |
IEEE 1667 No |
Power Loss Protection No |
Write Endurance 200TBW |
MTBF 2M hours |
Avg Power 6.3W |
Idle Power 150mW |
Sleep Power 2.5mW |
Max Op Temp 70°C |
Min Non-Op Temp -40°C |
Max Non-Op Temp 85°C |
Height 22mm (0.87")Width 30mm (1.18")Depth 2.2mm (0.09") |
Manufacturer Micron |
Model 2500 |
Description 512GB M.2-2230 |
Part Number MTFDKBK512QGN-1BD1AAB |