Storage Comparison
Capacity 256GB |
Sequential Read 4.5GB/s |
Sequential Write 2GB/s |
Form Factor M.2-2242 |
Interface PCIe |
Protocol NVMe |
NAND 3D TLC (232L) |
Capacity 256GB |
Sequential Read 4.5GB/s |
Sequential Write 2GB/s |
Rand Read IOPS 380K IOPS |
Rand Write IOPS 400K IOPS |
Form Factor M.2-2242 |
M.2 Size 2242 |
M.2 Key M |
M.2 Type S3 |
Interface PCIe 4.0 x4 |
Protocol NVMe 1.4 |
Manufacturer Micron |
Codename B58R |
Process Node 20nm |
Type 3D TLC (232L) |
Layers 232L |
Die Size 70mm² |
Die Capacity 1024Gbit |
Die Bit Density 14.63Gbit/mm² |
NAND Chip Count 1 |
NAND Die Count 2 |
NAND Dies/Chip 2 |
TCG Opal 2.0 Yes |
Write Endurance 150TBW |
MTBF 2M hours |
Avg Power 5.5W |
Idle Power 150mW |
Sleep Power 2.5mW |
Max Op Temp 70°C |
Min Non-Op Temp -40°C |
Max Non-Op Temp 85°C |
Height 22 mm (0.87")Width 42 mm (1.65")Depth 2.2 mm (0.09") |
Manufacturer Micron |
Model 2550 |
Description 256GB M.2-2242 |
Part Number MTFDKCD512TGE-1BD1AAB |
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