Storage Comparison
Capacity 512GB |
Sequential Read 3.4GB/s |
Sequential Write 2.8GB/s |
Form Factor Soldered |
Interface PCIe |
Protocol NVMe |
NAND 3D TLC (176L) |
Capacity 512GB |
Sequential Read 3.4GB/s |
Sequential Write 2.8GB/s |
Form Factor Soldered |
Interface PCIe 4.0 x2 |
Protocol NVMe 1.4 |
Manufacturer Micron |
Codename B47R |
Process Node 20nm |
Type 3D TLC (176L) |
Layers 176L |
Die Size 50mm² |
Die Capacity 512Gbit |
Die Bit Density 10.27Gbit/mm² |
NAND Chip Count 2 |
NAND Die Count 8 |
NAND Dies/Chip 4 |
Write Endurance 300TBW |
MTBF 2M hours |
Max Op Temp 70°C |
Min Non-Op Temp -40°C |
Max Non-Op Temp 85°C |
Height 22 mm (0.87")Width 30 mm (1.18")Depth 2.2 mm (0.09") |
Manufacturer Micron |
Model 3460 |
Description 512GB Soldered |
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