BG3
512GB Soldered
Storage Comparison
Capacity 512GB |
Sequential Read 1.5GB/s |
Sequential Write 1.1GB/s |
Form Factor Soldered |
Interface PCIe |
Protocol NVMe |
NAND 3D TLC (64L) |
BG31,520MB/sCapacity 512GB |
Sequential Read 1.5GB/s |
Sequential Write 1.1GB/s |
Form Factor Soldered |
Interface PCIe 3.0 x2 |
Protocol NVMe 1.2 |
Manufacturer Kioxia |
Codename BiCS3 |
Process Node 19nm |
Type 3D TLC (64L) |
Layers 64L |
Die Size 132mm² |
Die Capacity 512Gbit |
Die Bit Density 3.88Gbit/mm² |
NAND Die Count 8 |
MTBF 1.5M hours |
Avg Power 3.3W |
Sleep Power 5mW |
Manufacturer Toshiba |
Model BG3 |
Description 512GB Soldered |
Part Number KBG30ZMS512G |