AMD Ryzen AI Max 385 vs IBM 2x PowerPC 970FX+ 1.8GHz

AMD Ryzen AI Max 385
IBM 2x PowerPC 970FX+ 1.8GHz
8 Cores
16 Threads
3.6GHz Clock
2 Cores
2 Threads
1.8GHz Clock
Socket
FP11
Socket
Unknown
iGPU
Radeon 8050S
11.47 TFLOPS FP32
iGPU
No GPU
- -
  • 55% higher vs 2x PowerPC 970FX+ 1.8GHz
  • 35% lower vs Ryzen AI Max 385
Ryzen AI Max 385 - 65W
x1.55
2x PowerPC 970FX+ 1.8GHz - 42W
x1
Manufacturer
AMD
Manufacturer
IBM
Architecture
Zen 5
Architecture
G5
Family
Ryzen AI 300
Family
G5
Instruction Set (ISA)
x86-64
Instruction Set (ISA)
PowerPC
Codename
Strix Halo
Eldora
Zen 5
Codename
GP-UL FX
-
-
Market Segment
Laptop
Market Segment
Desktop
Release Date
1/6/2025
Release Date
1/1/2004
Foundry
TSMC
TSMC (SoC Die)
Foundry
IBM
-
Node
N4X
N5 (SoC Die)
Node
90nm
-
Die Size
71 mm²
Die Size
66 mm²
Transistor Count
8.3 Billion
Transistor Count
58 Million
FP11
Unknown
8 Cores
2 Cores
16 Threads
2 Threads
3.6GHz
5GHz Boost
1.8GHz
-
Overclocking
Locked
Overclocking
Locked
Type
PCIe
Type
FSB
-
-
Clock
900MHz
-
-
Data Rate
Double
Transfer Rate
16GT/s
Transfer Rate
1.8GT/s
-
-
Width
64Bit
Lanes
4
-
-
Bandwidth
8GB/s
Bandwidth
14.4GB/s
Bi-directional
16GB/s
Bi-directional
28.8GB/s
L1 Instruction
32KB/Core
8-way set associative
L1 Instruction
64KB/Core
4-way set associative
L1 Data
48KB/Core
12-way set associative
L1 Data
32KB/Core
4-way set associative
L2
1024KB/Core
16-way set associative
L2
512KB/Core
8-way set associative
L3
32MB Shared
16-way set associative
-
-
-
Channels
4
No Memory Controller
Max Memory
128GB
ECC
Not Supported
Bus Width/Channel
64Bit
Bus Width
256Bit
Clock
4000MHz
Transfer Rate
8000MT/s
Bandwidth/Channel
64.0GB/s
Bandwidth
256.0GB/s
TDP
65W
45W cTDP Down
120W cTDP Up
TDP
42W
-
-
Temp
100°C Max
-
-
PCIe 4.0 x16 Lanes
No PCIe
Radeon 8050S
2048 Shaders
2800MHz
11.47 TFLOPS FP32
No GPU
-
-
- -
XDNA 2
No NPU
-
32 Cores
-
50 TOPS INT8
-
No Cellular
No Cellular
Change Comparison