AMD Ryzen AI Max 385 vs Intel Core Ultra 7 155HL
AMD Ryzen AI Max 385
Intel Core Ultra 7 155HL
$438
8 Cores
16 Threads
3.6GHz Clock
|
16 Cores
22 Threads
1.4GHz Clock
|
Socket
FP11
|
Socket
LGA 1851
|
iGPU
Radeon 8050S
11.47 TFLOPS FP32
|
iGPU
Arc 8C 2250MHz
4.61 TFLOPS FP32
|
|
|
Ryzen AI Max 385 - 256.0GB/s
x2.86
Core Ultra 7 155HL - 89.6GB/s
x1
|
|
Ryzen AI Max 385 - 65W
x1.44
Core Ultra 7 155HL - 45W
x1
|
|
Ryzen AI Max 385 - 11.47 TFLOPS FP32
x2.49
Core Ultra 7 155HL - 4.61 TFLOPS FP32
x1
|
|
Ryzen AI Max 385 - 50 TOPS INT8
x4.35
Core Ultra 7 155HL - 11.5 TOPS INT8
x1
GB6S N/A
0%
|
GB6S 2,400
59%
|
GB6M N/A
0%
|
GB6M 12,500
47%
|
0%
|
0%
|
0%
|
0%
|
Manufacturer
AMD
|
Manufacturer
Intel
|
Architecture
Zen 5
|
Architecture
Meteor Lake
|
Family
Ryzen AI 300
|
Family
Core Ultra Series 1
|
Instruction Set (ISA)
x86-64
|
Instruction Set (ISA)
x86-64
|
Codename
Strix Halo
Eldora
-
-
Zen 5
-
-
|
Codename
Meteor Lake-H
-
Meteor Lake-P-6P
P-Core
Redwood Cove
E-Core
Crestmont
|
Market Segment
Laptop
|
Market Segment
Laptop
|
Release Date
1/6/2025
|
Release Date
4/8/2024
|
Foundry
TSMC
TSMC (SoC Die)
-
-
|
Foundry
Intel
TSMC (iGPU Die)
TSMC (SoC Die)
TSMC (IO Die)
|
Node
N4X
N5 (SoC Die)
-
-
|
Node
Intel 4
N5 (iGPU Die)
N6 (SoC Die)
N6 (IO Die)
|
Die Size
71 mm²
-
-
-
|
Die Size
68 mm²
44 mm² (iGPU Die)
100 mm² (SoC Die)
28 mm² (IO Die)
|
Transistor Count
8.3 Billion
|
Transistor Count
10 Billion
|
8 Cores
-
-
-
|
16 Cores
6 P-Cores
8 M-Cores
2 E-Cores
|
16 Threads
-
-
-
|
22 Threads
12 P-Threads
8 M-Cores
2 E-Threads
|
-
3.6GHz
5GHz Boost
|
P-Core
1.4GHz
4.8GHz Boost
|
-
-
|
M-Core
900MHz
|
-
-
-
|
E-Core
700MHz
2.5GHz Boost
|
Overclocking
Locked
|
Overclocking
Locked
|
Type
PCIe
|
Integrated Chipset
-
|
Transfer Rate
16GT/s
|
-
-
|
Lanes
4
|
-
-
|
Bandwidth
8GB/s
|
-
-
|
Bi-directional
16GB/s
|
-
-
|
L0 Instruction
|
L0 Instruction
|
L0 Data
|
L0 Data
|
L1 Instruction
32KB/Core
8-way set associative
-
-
|
L1 Instruction
64KB/P-Core
8-way set associative
64KB/E-Core
8-way set associative
|
L1 Data
48KB/Core
12-way set associative
-
-
|
L1 Data
48KB/P-Core
12-way set associative
32KB/E-Core
8-way set associative
|
L2
1024KB/Core
16-way set associative
-
-
|
L2
2048KB/Core
16-way set associative
4MB Shared (E-Core)
16-way set associative
|
L3
32MB Shared
16-way set associative
|
L3
24MB Shared
12-way set associative
|
Channels
4
|
Channels
2
|
Max Memory
128GB
|
Max Memory
96GB
|
ECC
Not Supported
|
ECC
Not Supported
|
Bus Width/Channel
64Bit
Bus Width
256Bit
|
Bus Width/Channel
64Bit
Bus Width
128Bit
|
Clock
4000MHz
Transfer Rate
8000MT/s
|
Clock
2800MHz
Transfer Rate
5600MT/s
|
Bandwidth/Channel
64.0GB/s
Bandwidth
256.0GB/s
|
Bandwidth/Channel
44.8GB/s
Bandwidth
89.6GB/s
|
TDP
65W
45W cTDP Down
120W cTDP Up
-
|
TDP
45W
20W cTDP Down
65W cTDP Up
115W Peak
|
Temp
100°C Max
|
Temp
105°C Max
|
Included Cooler
|
Included Cooler
|
PCIe 4.0 x16 Lanes
|
PCIe 4.0 x20 Lanes
|
Radeon 8050S
2048 Shaders
2800MHz
11.47 TFLOPS FP32
|
Arc 8C 2250MHz
1024 Shaders
2250MHz
4.61 TFLOPS FP32
|
XDNA 2
|
AI Boost 3
|
-
32 Cores
|
1.4MHz
2 Cores
|
50 TOPS INT8
|
11.5 TOPS INT8
|
No Cellular
|
No Cellular
|








































































































































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