Ryzen AI 9 HX 370 Specs
Ryzen AI 9 HX 370
|
12 Cores
24 Threads
2GHz Clock
|
|
Socket
FP8
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iGPU
Radeon 890M 2900MHz
|
|
GB6S 2,900
77%
|
|
GB6M 14,720
61%
|
|
CB23S 2,035
87%
|
|
CB23M 23,785
58%
|
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Manufacturer
AMD
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Architecture
Zen 5
|
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Family
Ryzen AI 300
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Instruction Set (ISA)
x86-64
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Codename
Strix Point
-
-
P-Core
Zen 5
-
-
E-Core
Zen 5c
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Market Segment
Laptop
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|
Release Date
6/2/2024
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Foundry
TSMC
TSMC (IO Die)
-
-
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Node
N4P
N6 (IO Die)
-
-
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Die Size
233 mm²
388 mm² (IO Die)
-
-
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Transistor Count
28 Billion
11 Billion (IO Die)
-
-
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12 Cores
4 P-Cores
-
8 E-Cores
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24 Threads
8 P-Threads
-
16 E-Threads
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|
-
2GHz
5.1GHz Boost
-
|
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-
-
-
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-
-
-
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Overclocking
Locked
-
-
-
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Type
PCIe
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|
-
-
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-
-
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Transfer Rate
16GT/s
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|
-
-
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Lanes
4
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Bandwidth
8GB/s
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Bi-directional
16GB/s
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L0 Instruction
-
-
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L0 Data
-
-
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L1 Instruction
32KB/Core
8-way set associative
-
-
-
-
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L1 Data
48KB/Core
12-way set associative
-
-
-
-
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L2
1024KB/Core
16-way set associative
-
-
-
-
-
-
-
-
-
-
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|
L3
-
24MB Shared
-
16-way set associative
-
-
-
-
-
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|
-
-
-
-
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Channels
2
|
|
Max Memory
256GB
64GB
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|
ECC
Not Supported
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Bus Width/Channel
64Bit
Bus Width
128Bit
|
|
Clock
3750MHz
2800MHz
Transfer Rate
7500MT/s
5600MT/s
|
|
Bandwidth/Channel
60.0GB/s
44.8GB/s
Bandwidth
120.0GB/s
89.6GB/s
|
|
TDP
28W
15W cTDP Down
54W cTDP Up
-
|
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Temp
100°C Max
-
|
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Included Cooler
Not Included
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PCIe 4.0 x16 Lanes
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Radeon 890M 2900MHz
1024 Shaders
2900MHz
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XDNA 2
|
|
-
32 Cores
|
|
50 TOPS
INT8
|
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-
-
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No Cellular
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