Ryzen AI 9 HX 370 vs M3 Max 14C30G
Ryzen AI 9 HX 370
M3 Max 14C30G
|
12 Cores
24 Threads
2GHz Clock
|
14 Cores
14 Threads
4.05GHz Clock
|
|
Socket
FP8
|
Socket
Unknown
|
|
iGPU
Radeon 890M 2900MHz
|
iGPU
30-Core M3 Max
|
|
GB6S 2,900
77%
|
GB6S 3,180
84%
|
|
GB6M 14,720
61%
|
GB6M 19,515
81%
|
|
CB23S 2,035
87%
|
CB23S 1,995
85%
|
|
CB23M 23,785
58%
|
CB23M 22,195
54%
|
|
Manufacturer
AMD
|
Manufacturer
Apple
|
|
Architecture
Zen 5
|
Architecture
Apple Silicon 13
|
|
Family
Ryzen AI 300
|
Family
M Series
|
|
Instruction Set (ISA)
x86-64
|
Instruction Set (ISA)
ARMv8.6-A
|
|
Codename
Strix Point
-
-
P-Core
Zen 5
-
-
E-Core
Zen 5c
|
Codename
Palma
-
M3 Max
P-Core
AS13P
-
-
E-Core
AS13E
|
|
Market Segment
Laptop
|
Market Segment
Laptop
|
|
Release Date
6/2/2024
|
Release Date
10/30/2023
|
|
Foundry
TSMC
TSMC (IO Die)
-
-
|
Foundry
TSMC
-
-
-
|
|
Node
N4P
N6 (IO Die)
-
-
|
Node
N3B
-
-
-
|
|
Die Size
233 mm²
388 mm² (IO Die)
-
-
|
Die Size
503 mm²
-
-
-
|
|
Transistor Count
28 Billion
11 Billion (IO Die)
-
-
|
Transistor Count
92 Billion
-
-
-
|
| FP8 |
Unknown
|
|
12 Cores
4 P-Cores
-
8 E-Cores
|
14 Cores
10 P-Cores
-
4 E-Cores
|
|
24 Threads
8 P-Threads
-
16 E-Threads
|
14 Threads
10 P-Threads
-
4 E-Threads
|
|
-
2GHz
5.1GHz Boost
-
|
P-Core
4.05GHz
-
-
|
|
-
-
-
|
-
-
-
|
|
-
-
-
|
E-Core
2.8GHz
-
|
|
Overclocking
Locked
-
-
-
|
Overclocking
Locked
-
-
-
|
|
Type
PCIe
|
Integrated Chipset
-
|
|
-
-
|
-
-
|
|
-
-
|
-
-
|
|
Transfer Rate
16GT/s
|
-
-
|
|
-
-
|
-
-
|
|
Lanes
4
|
-
-
|
|
Bandwidth
8GB/s
|
-
-
|
|
Bi-directional
16GB/s
|
-
-
|
|
L0 Instruction
-
-
|
L0 Instruction
-
-
|
|
L0 Data
-
-
|
L0 Data
-
-
|
|
L1 Instruction
32KB/Core
8-way set associative
-
-
-
-
|
L1 Instruction
192KB/P-Core
6-way set associative
-
-
128KB/E-Core
4-way set associative
|
|
L1 Data
48KB/Core
12-way set associative
-
-
-
-
|
L1 Data
128KB/P-Core
4-way set associative
-
-
64KB/E-Core
2-way set associative
|
|
L2
1024KB/Core
16-way set associative
-
-
-
-
-
-
-
-
-
-
|
L2
-
-
32MB Shared
16-way set associative
-
-
-
-
-
-
4MB Shared (E-Core)
16-way set associative
|
|
L3
-
24MB Shared
-
16-way set associative
-
-
-
-
-
|
-
-
-
-
-
-
-
-
-
-
|
|
-
-
-
-
|
-
-
-
48MB SLC Cache
|
|
Channels
2
|
Channels
3
|
|
Max Memory
256GB
64GB
|
Max Memory
96GB
|
|
ECC
Not Supported
|
ECC
Not Supported
|
|
Bus Width/Channel
64Bit
Bus Width
128Bit
|
Bus Width/Channel
128Bit
Bus Width
384Bit
|
|
Clock
3750MHz
2800MHz
Transfer Rate
7500MT/s
5600MT/s
|
Clock
3200MHz
Transfer Rate
6400MT/s
|
|
Bandwidth/Channel
60.0GB/s
44.8GB/s
Bandwidth
120.0GB/s
89.6GB/s
|
Bandwidth/Channel
102.4GB/s
Bandwidth
307.2GB/s
|
|
TDP
28W
15W cTDP Down
54W cTDP Up
-
|
TDP
90W
-
-
-
|
|
Temp
100°C Max
-
|
Temp
100°C Max
-
|
|
Included Cooler
Not Included
|
Included Cooler
Not Included
|
|
PCIe 4.0 x16 Lanes
|
No PCIe
|
|
Radeon 890M 2900MHz
1024 Shaders
2900MHz
|
30-Core M3 Max
3840 Shaders
1398MHz
|
|
XDNA 2
|
-
|
|
-
32 Cores
|
-
16 Cores
|
|
50 TOPS
INT8
|
18 TOPS
FP16
|
|
-
-
|
-
-
|
|
No Cellular
|
No Cellular
|
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