Intel Core i3-8145U vs Qualcomm Snapdragon 8cx Gen 1 Full Specs
2 Cores 4 Threads 2.1GHz | 8 Cores(4P+4E) 8 Threads(4P+4E) 2.84GHz |
TDP 15W | TDP - |
Bandwidth 38.4GB/s · | Bandwidth 68.3GB/s LPDDR4X |
iGPU | iGPU |
·· 384 GFLOPSFP16 | ·· 3.69 TFLOPSFP16 |
Socket | Socket - |
2 Cores 2P - | 8 Cores 4P 4E |
4 Threads 4P - | 8 Threads 4P 4E |
Base Clock 2.1GHz | Base Clock 2.84GHz |
Boost Clock 3.9GHz | Boost Clock - |
Overclocking Locked | Overclocking Locked |
L1i 32KB P - | L1i 64KB P 32KB E |
L1d 32KB P - | L1d 64KB P 32KB E |
L2 256KB P - | L2 512KB P 128KB E |
L3 4MB | L3 2MB |
SLC Cache - | SLC Cache 3MB |
Type · | Type LPDDR4X |
Max Memory 64GB | Max Memory 16GB |
ECC No | ECC No |
Channels 2 | Channels 8 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 2400MT/s | Speed 4266MT/s |
Bandwidth 38.4GB/s | Bandwidth 68.3GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 38.4GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 68.3GB/s |
TDP 15W | TDP - |
cTDP-down 10W | cTDP-down - |
cTDP-up 25W | cTDP-up - |
Max Operating Temp 100°C Max | Max Operating Temp - |
Bus Type OPI | Bus Type - |
Bus Config 4 lanes | Bus Config - |
Bus Speed 4GT/s | Bus Speed - |
Bus Bandwidth 2GB/s | Bus Bandwidth - |
PCIe PCIe 3.0 x1615.8GB/sBandwidth | - |
iGPU | iGPU |
Shaders 192 | Shaders 1536 |
Boost Clock 1GHz | Boost Clock 600MHz |
·· 384 GFLOPSFP16 | ·· 3.69 TFLOPSFP16 |
NPU Model - | NPU Model Hexagon 690 |
Performance - | Performance 9 TOPS |
Modem Model - | Modem Model X55 |
Cellular - | Cellular 5G mmWave |
Peak Down - | Peak Down Up to 7.5Gbps |
Peak Up - | Peak Up Up to 3.0Gbps |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture Kryo 495ARMv8.2-A |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Whiskey Lake-U Whiskey Lake-4CVariant - - | Codename - Snapdragon 8cx Gen 1Variant Cortex-A76P-Core Cortex-A55E-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Aug 28, 2018 | Release Date Jul 9, 2019 |
Foundry Intel | Foundry TSMC |
Fabrication Node 14nm+ | Fabrication Node N7 |
Die Size 123mm² | Die Size - |
Transistor Count 2.1 Billion | Transistor Count - |
Transistor Density 17 MTr/mm² | Transistor Density - |
No images available
No images available
Laptops - | Laptops |



