Intel Core i5-10600 vs AMD Ryzen 5 3600 Full Specs

Summary

6 Cores 12 Threads 3.3GHz	6 Cores 12 Threads 3.6GHz
TDP 65W	TDP 65W
Bandwidth 42.7GB/s DDR4	Bandwidth 51.2GB/s DDR4
iGPU UHD 630 1200MHz	iGPU -
Peak·FP32·FP16 460.8 GFLOPSFP16	Peak·FP32·FP16 -
Socket LGA 1200	Socket AM4

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i5-106001,602

x1.02

Ryzen 5 36001,577

x1

Show Top Score

Core Config

6 Cores	6 Cores
12 Threads	12 Threads

Clocks

Base Clock 3.3GHz	Base Clock 3.6GHz
Boost Clock 4.8GHz	Boost Clock 4.2GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 256KB	L2 512KB
L3 12MB	L3 32MB

Memory

Type DDR4	Type DDR4
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 2666MT/s	Speed 3200MT/s
Bandwidth 42.7GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate2666MT/s Calculated Bandwidth 42.7GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP 65W	TDP 65W
Peak Power -	Peak Power 88W
Max Operating Temp 100°C Max	Max Operating Temp 95°C Max
Included Cooler 1	Included Cooler 1

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 8GT/s	Bus Speed 16GT/s
Bus Bandwidth 4GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

iGPU

iGPU UHD 630 1200MHz	iGPU -
Shaders 192	Shaders -
Boost Clock 1.2GHz	Boost Clock -
Peak·FP32·FP16 460.8 GFLOPSFP16	Peak·FP32·FP16 -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Zen 2
Family Core 10th Gen	Family Ryzen 3000
Branding	Branding
Codename Comet Lake-H - Comet Lake-6CVariant	Codename Matisse Aspen HighlandsDie Matisse 1CCDVariant
Market Segment Desktop	Market Segment Desktop
Release Date Apr 30, 2020	Release Date Jul 7, 2019

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries -	Other Foundries GlobalFoundriesIO
Fabrication Node 14nm+++ -	Fabrication Node N7 12LPIO
Die Size 150mm² -	Die Size 74mm² 125mm²IO
Transistor Count 2.5 Billion -	Transistor Count 3.8 Billion 2.1 BillionIO
Transistor Density 17 MTr/mm² -	Transistor Density 51 MTr/mm² 17 MTr/mm²IO

Images

No images available

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Used In

All-in-Ones iMac 27(Mid 2020)

All-in-Ones -

Competitors

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