Intel Core i9-10900 vs AMD Ryzen 9 PRO 3900 Full Specs

Summary

10 Cores 20 Threads 2.8GHz	12 Cores 24 Threads 3.1GHz
TDP 65W	TDP 65W
Bandwidth 46.9GB/s DDR4	Bandwidth 51.2GB/s DDR4
iGPU UHD 630 1200MHz	iGPU 0
Peak·FP32·FP16 460.8 GFLOPSFP16	Peak·FP32·FP16 -
Socket LGA 1200	Socket AM4

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i9-109001,802

x1.05

Ryzen 9 PRO 39001,715

x1

Show Top Score

Core Config

10 Cores	12 Cores
20 Threads	24 Threads

Clocks

Base Clock 2.8GHz	Base Clock 3.1GHz
Boost Clock 5.1GHz	Boost Clock 4.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 256KB	L2 512KB
L3 20MB	L3 64MB

Memory

Type DDR4	Type DDR4
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 2933MT/s	Speed 3200MT/s
Bandwidth 46.9GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate2933MT/s Calculated Bandwidth 46.9GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP 65W	TDP 65W
Max Operating Temp 100°C Max	Max Operating Temp 95°C Max
Included Cooler 1	Included Cooler -

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 8GT/s	Bus Speed 16GT/s
Bus Bandwidth 4GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

iGPU

iGPU UHD 630 1200MHz	iGPU 0
Shaders 192	Shaders -
Boost Clock 1.2GHz	Boost Clock -
Peak·FP32·FP16 460.8 GFLOPSFP16	Peak·FP32·FP16 -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Zen 2
Family Core 10th Gen	Family Ryzen 3000
Branding	Branding
Codename Comet Lake-S - Comet Lake-10CVariant	Codename Matisse Aspen HighlandsDie Matisse 2CCDVariant
Market Segment Desktop	Market Segment Desktop
Release Date Apr 30, 2020	Release Date Sep 30, 2019

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries -	Other Foundries GlobalFoundriesIO
Fabrication Node 14nm+++ -	Fabrication Node N7 12LPIO
Die Size 198mm² -	Die Size 148mm² 125mm²IO
Transistor Count 3.4 Billion -	Transistor Count 7.6 Billion 2.1 BillionIO
Transistor Density 17 MTr/mm² -	Transistor Density 51 MTr/mm² 17 MTr/mm²IO

Images

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Used In

All-in-Ones Envy 32(Early 2020)

All-in-Ones -

Competitors

IntelCore i9-10900 vs CPU AMDRyzen 7 9700X IntelCore i9-10900 vs CPU AMDRyzen 7 9800X3D IntelCore i9-10900 vs CPU AMDRyzen 9 9900X Show 12 more

AMDRyzen 9 PRO 3900 vs CPU AMDRyzen 7 5705G AMDRyzen 9 PRO 3900 vs CPU AMDRyzen 7 5705GE AMDRyzen 9 PRO 3900 vs CPU AMDRyzen 3 5305G Show 12 more