Intel Core Ultra 5 235H vs AMD Ryzen AI 5 340 Full Specs
14 Cores(4P+8M+2E) 14 Threads(4P+8M+2E) 2.4GHz | 6 Cores(3P+3E) 12 Threads(6P+6E) 2GHz |
TDP 28W | TDP 28W |
Bandwidth 134.4GB/s · | Bandwidth 128GB/s · |
iGPU | iGPU |
·· 9.22 TFLOPSFP16 | ·· 2.97 TFLOPSFP16 |
Socket | Socket |
Core Ultra 5 235H2.5GHz
Ryzen AI 5 340-14 Cores 4P 8M 2E | 6 Cores 3P - 3E |
14 Threads 4P 8M 2E | 12 Threads 6P - 6E |
Base Clock 2.4GHz | Base Clock 2GHz |
Boost Clock 5GHz | Boost Clock 4.8GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 64KB E | L1i 32KB P - - |
L1d 48KB P 32KB M 32KB E | L1d 48KB P - - |
L2 3MB P 8MB M shared 2MB E shared | L2 1MB P - - |
L3 12MB | L3 16MB |
Type · | Type · |
Max Memory 128GB | Max Memory 256GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8400MT/s | Speed 8000MT/s |
Bandwidth 134.4GB/s | Bandwidth 128GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 134.4GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 128GB/s |
TDP 28W | TDP 28W |
cTDP-down 20W | cTDP-down 15W |
cTDP-up - | cTDP-up 54W |
Peak Power 115W | Peak Power - |
Max Operating Temp 110°C Max | Max Operating Temp 100°C Max |
Included Cooler - | Included Cooler 0 |
Bus Type - | Bus Type PCIe |
Bus Config - | Bus Config 4 lanes |
Bus Speed - | Bus Speed 16GT/s |
Bus Bandwidth - | Bus Bandwidth 8GB/s |
PCIe PCIe 5.0 x831.5GB/sBandwidth | PCIe PCIe 4.0 x1631.5GB/sBandwidth |
PCIe Secondary PCIe 4.0 x2039.4GB/sBandwidth | - |
iGPU | iGPU |
Shaders 1024 | Shaders 256 |
Boost Clock 2.25GHz | Boost Clock 2.9GHz |
·· 9.22 TFLOPSFP16 | ·· 2.97 TFLOPSFP16 |
NPU Model AI Boost 3 | NPU Model XDNA 2 |
NPU Cores 2 | NPU Cores 32 |
Performance 13 TOPSINT8 | Performance 50 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Arrow Lake-H Arrow Lake-H-4P-8EVariant Lion CoveP-Core SkymontM-Core CrestmontE-Core | Codename Strix Point - Zen 5P-Core - Zen 5cE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 6, 2025 | Release Date Jan 6, 2025 |
Foundry TSMC | Foundry TSMC |
Other Foundries TSMCiGPU TSMCIO TSMCSoC | Other Foundries - |
Fabrication Node N3B N5iGPU N6IO N6SoC | Fabrication Node N4P - - - |
Die Size - 44mm²iGPU 28mm²IO 100mm²SoC | Die Size 233mm² - - - |
Transistor Count - | Transistor Count 28 Billion |
Transistor Density - | Transistor Density 120 MTr/mm² |
No images available
No images available
Laptops - | Laptops |