Intel Core Ultra 5 235HX vs Qualcomm Snapdragon X (X1-26-100)
Intel Core Ultra 5 235HX
$349
Qualcomm Snapdragon X (X1-26-100)
|
14 Cores
14 Threads
2.9GHz Clock
|
8 Cores
8 Threads
3GHz Clock
|
|
Socket
BGA 2114
|
Socket
Unknown
|
|
iGPU
Graphics 3C 1800MHz
1.38 TFLOPS FP32
|
iGPU
Adreno X1 1.7T
1.71 TFLOPS FP32
|
|
|
Core Ultra 5 235HX - 102.4GB/s
x1
Snapdragon X (X1-26-100) - 135.2GB/s
x1.32
|
|
Core Ultra 5 235HX - 55W
x2.39
Snapdragon X (X1-26-100) - 23W
x1
|
|
Core Ultra 5 235HX - 1.38 TFLOPS FP32
x1
Snapdragon X (X1-26-100) - 1.71 TFLOPS FP32
x1.24
|
|
Core Ultra 5 235HX - 13 TOPS INT8
x1
Snapdragon X (X1-26-100) - 45 TOPS INT8
x3.46
|
0%
|
0%
|
|
0%
|
0%
|
|
0%
|
0%
|
|
0%
|
0%
|
|
Manufacturer
Intel
|
Manufacturer
Qualcomm
|
|
Architecture
Arrow Lake
|
Architecture
Oryon
|
|
Family
Core Ultra Series 2
|
Family
X Series
|
|
Instruction Set (ISA)
x86-64
|
Instruction Set (ISA)
AArch64
|
|
Codename
Arrow Lake-S-8P-16E
P-Core
Lion Cove
E-Core
Skymont
|
Codename
Snapdragon X Elite
-
Phoenix
-
-
|
|
Market Segment
Laptop
|
Market Segment
Laptop
|
|
Release Date
1/6/2025
|
Release Date
1/6/2025
|
|
Foundry
TSMC
TSMC (iGPU Die)
TSMC (SoC Die)
TSMC (IO Die)
|
Foundry
TSMC
-
-
-
|
|
Node
N3B
N5 (iGPU Die)
N6 (SoC Die)
N6 (IO Die)
|
Node
N4P
-
-
-
|
|
Die Size
135 mm²
23 mm² (iGPU Die)
100 mm² (SoC Die)
28 mm² (IO Die)
|
Die Size
170 mm²
-
-
-
|
|
Transistor Count
Unknown
|
Transistor Count
Unknown
|
| BGA 2114 |
Unknown
|
|
14 Cores
6 P-Cores
8 E-Cores
|
8 Cores
-
-
|
|
14 Threads
6 P-Threads
8 E-Threads
|
8 Threads
-
-
|
|
P-Core
2.9GHz
5.1GHz Boost
|
-
3GHz
-
|
|
E-Core
2.6GHz
4.5GHz Boost
|
-
-
-
|
|
Overclocking
Unlocked
|
Overclocking
Locked
|
|
Type
DMI
|
Integrated Chipset
-
|
|
Transfer Rate
16GT/s
|
-
-
|
|
Lanes
8
|
-
-
|
|
Bandwidth
16GB/s
|
-
-
|
|
Bi-directional
32GB/s
|
-
-
|
|
L0 Instruction
|
L0 Instruction
|
|
L0 Data
|
L0 Data
|
|
L1 Instruction
64KB/P-Core
8-way set associative
64KB/E-Core
8-way set associative
|
L1 Instruction
192KB/Core
4-way set associative
-
-
|
|
L1 Data
48KB/P-Core
12-way set associative
32KB/E-Core
8-way set associative
|
L1 Data
96KB/Core
2-way set associative
-
-
|
|
L2
3072KB/Core
10-way set associative
-
-
8MB Shared (E-Core)
16-way set associative
|
L2
-
-
24MB Shared
12-way set associative
-
-
|
|
L3
24MB Shared
12-way set associative
|
-
-
-
|
|
-
|
6MB SLC Cache
|
|
Channels
2
|
Channels
8
|
|
Max Memory
192GB
|
Max Memory
64GB
|
|
ECC
Not Supported
|
ECC
Not Supported
|
|
Bus Width/Channel
64Bit
Bus Width
128Bit
|
Bus Width/Channel
16Bit
Bus Width
128Bit
|
|
Clock
3200MHz
Transfer Rate
6400MT/s
|
Clock
4224MHz
Transfer Rate
8448MT/s
|
|
Bandwidth/Channel
51.2GB/s
Bandwidth
102.4GB/s
|
Bandwidth/Channel
16.9GB/s
Bandwidth
135.2GB/s
|
|
TDP
55W
45W cTDP Down
160W Peak
|
TDP
23W
-
-
|
|
Temp
105°C Max
|
-
-
|
|
Included Cooler
|
Included Cooler
|
|
PCIe 5.0 x20 Lanes
PCIe 4.0 x4 Lanes
|
No PCIe
|
|
Graphics 3C 1800MHz
384 Shaders
1800MHz
1.38 TFLOPS FP32
|
Adreno X1 1.7T
1024 Shaders
833MHz
1.71 TFLOPS FP32
|
|
AI Boost 3
|
Hexagon
|
|
2 Cores
|
-
|
|
13 TOPS INT8
|
45 TOPS INT8
|
|
No Cellular
|
No Cellular
|
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