Intel Core Ultra 9 275HX vs AMD Ryzen 9 PRO 8945HS Full Specs
24 Cores(8P+16E) 24 Threads(8P+16E) 2.7GHz | 8 Cores 16 Threads 4GHz |
TDP 55W | TDP 45W |
Bandwidth 102.4GB/s DDR5 | Bandwidth 120GB/s · |
iGPU | iGPU |
·· 3.89 TFLOPSFP16 | ·· 8.29 TFLOPSFP16 |
Socket | Socket |
Core Ultra 9 275HX3,044
Ryzen 9 PRO 8945HS2,38724 Cores 8P 16E | 8 Cores 8P - |
24 Threads 8P 16E | 16 Threads 16P - |
Base Clock 2.7GHz | Base Clock 4GHz |
Boost Clock 5.4GHz | Boost Clock 5.2GHz |
Overclocking Unlocked | Overclocking Locked |
L1i 64KB P 64KB E | L1i 32KB P - |
L1d 48KB P 32KB E | L1d 32KB P - |
L2 3MB P 16MB E shared | L2 1MB P - |
L3 24MB | L3 16MB |
Type DDR5 | Type · |
Max Memory 192GB | Max Memory 256GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 6400MT/s | Speed 7500MT/s |
Bandwidth 102.4GB/s | Bandwidth 120GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 102.4GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 120GB/s |
TDP 55W | TDP 45W |
cTDP-down 45W | cTDP-down 35W |
cTDP-up - | cTDP-up 54W |
Peak Power 160W | Peak Power - |
Max Operating Temp 105°C Max | Max Operating Temp 100°C Max |
Bus Type DMI | Bus Type PCIe |
Bus Config 8 lanes | Bus Config 4 lanes |
Bus Speed 16GT/s | Bus Speed 16GT/s |
Bus Bandwidth 16GB/s | Bus Bandwidth 8GB/s |
PCIe PCIe 5.0 x2078.8GB/sBandwidth | PCIe PCIe 4.0 x2039.4GB/sBandwidth |
PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 512 | Shaders 768 |
Boost Clock 1.9GHz | Boost Clock 2.7GHz |
·· 3.89 TFLOPSFP16 | ·· 8.29 TFLOPSFP16 |
NPU Model AI Boost 3 | NPU Model XDNA |
NPU Cores 2 | NPU Cores - |
Performance 13 TOPSINT8 | Performance 16 TOPSINT4 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core | Codename Hawk Point - - - |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 6, 2025 | Release Date Apr 16, 2024 |
Foundry TSMC | Foundry TSMC |
Other Foundries TSMCiGPU TSMCIO TSMCSoC | Other Foundries - |
Fabrication Node N3B N5iGPU N6IO N6SoC | Fabrication Node N4 - - - |
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC | Die Size 178mm² - - - |
Transistor Count - | Transistor Count 25 Billion |
Transistor Density - | Transistor Density 140 MTr/mm² |
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Laptops | Laptops - |