CPUs

Qualcomm Snapdragon 8 Gen 3 vs MediaTek Dimensity 7300 Full Specs

8 Cores(1P+5M+2E)
8 Threads(1P+5M+2E)
3.3GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2.5GHz
TDP
5W
TDP
-
Bandwidth
76.8GB/s
LPDDR5X
Bandwidth
51.2GB/s
·
iGPU
iGPU
··
5.53 TFLOPSFP16
··
563.2 GFLOPSFP16

8 Cores
1P
5M
2E
8 Cores
4P
-
4E
8 Threads
1P
5M
2E
8 Threads
4P
-
4E

Base Clock
3.3GHz
Base Clock
2.5GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L2
1MB P
512KB M
128KB E
L2
1MB P
-
128KB E
L3
12MB
L3
4MB
SLC Cache
4MB
SLC Cache
-

Type
LPDDR5X
Type
·
Max Memory
24GB
Max Memory
-
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
9600MT/s
Speed
6400MT/s
Bandwidth
76.8GB/s
Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
51.2GB/s

TDP
5W
TDP
-

iGPU
iGPU
Shaders
1536
Shaders
128
Boost Clock
900MHz
Boost Clock
1.1GHz
··
5.53 TFLOPSFP16
··
563.2 GFLOPSFP16

NPU Model
Hexagon
NPU Model
MediaTek APU 655
Performance
45 TOPSINT8
Performance
-

Modem Model
X75
Modem Model
MT 5G+
Cellular
5G mmWave
Cellular
5G
Peak Down
Up to 10.0Gbps
Peak Down
Up to 3.3Gbps
Peak Up
Up to 3.5Gbps
Peak Up
Up to 900Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
KryoARMv9.0-A
Architecture
Family
Family
Branding
Snapdragon 8 Gen 3  branding
Branding
Dimensity  branding
Codename
Snapdragon 8 Gen 3Variant
Cortex-X4P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Codename
-
Cortex-A78P-Core
-
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 24, 2023
Release Date
Jun 1, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N7
Die Size
137mm²
Die Size
-