AMD EPYC 7F52

EPYC 7F52

Intel Xeon Platinum 8354H

Xeon Platinum 8354H

AMD EPYC 7F52 vs Intel Xeon Platinum 8354H Full Specs

16 Cores
32 Threads
3.5GHz
18 Cores
36 Threads
3.1GHz
TDP
240W
TDP
205W
Bandwidth
204.8GB/s
DDR4
Bandwidth
153.6GB/s
DDR4
Socket
Socket

EPYC 7F52EPYC 7F52
x1
Xeon Platinum 8354HXeon Platinum 8354H
x1.04

16 Cores
18 Cores
32 Threads
36 Threads

Base Clock
3.5GHz
Base Clock
3.1GHz
Boost Clock
3.9GHz
Boost Clock
4.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
512KB
L2
1MB
L3
256MB
L3
24.8MB

Type
DDR4
Type
DDR4
Max Memory
4.1TB
Max Memory
1.28TB
ECC
Yes
ECC
Yes
Channels
8
Channels
6
Bus Width
512-bit
Bus Width
384-bit
Speed
3200MT/s
Speed
3200MT/s
Bandwidth
204.8GB/s
Bandwidth
153.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
204.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
153.6GB/s

TDP
240W
TDP
205W
Included Cooler
-
Included Cooler
0

Bus Type
PCIe
Bus Type
UPI
Bus Config
8 lanes
Bus Config
16-bit
Bus Speed
16GT/s
Bus Speed
10.4GT/s
Bus Bandwidth
16GB/s
Bus Bandwidth
20.8GB/s

PCIe
PCIe 4.0 x128
252GB/sBandwidth
PCIe
PCIe 3.0 x48
47.3GB/sBandwidth

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
EPYC 2017 branding
Branding
Xeon Platinum 2020 branding
Codename
Rome
Aspen HighlandsDie
Rome 8CCDVariant
Codename
Cooper Lake-SP
-
Cooper Lake-SP-XCCVariant
Market Segment
Server
Market Segment
Server
Release Date
Apr 14, 2020
Release Date
Jun 18, 2020

Foundry
TSMC
Foundry
Intel
Other Foundries
GlobalFoundriesIO
Other Foundries
-
Fabrication Node
N7
12LPIO
Fabrication Node
14nm+++
-
Die Size
592mm²
416mm²IO
Die Size
700mm²
-
Transistor Count
30.4B
8.3BIO
Transistor Count
12.3B
-
Transistor Density
51 MTr/mm²
20 MTr/mm²IO
Transistor Density
18 MTr/mm²
-